10M08DCF256C8G vs 10M08DAF256C7G 对比
详细并排对比 10M08DCF256C8G 出自 Intel 和 10M08DAF256C7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M08DCF256C8G | 10M08DAF256C7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.28 | $7.95 |
| Series | MAX 10 | — |
| Logic Elements | 8,000 | — |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) | — |
| User I/O Count | 178 | — |
| 封装 | 256-LBGA (F256, FineLine BGA) | 256-pin LBGA (F256) |
| Pitch | 1.0 mm | — |
| Speed Grade | C8 (commercial, slowest speed bin) | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Configuration | Internal flash (instant-on, non-volatile) | Dual-configuration internal flash (D-series) |
| ADC | Dual 12-bit SAR, up to 17 analog inputs | — |
| 18x18 Multipliers | 8 | — |
| PLLs | 2 | 2 |
| Global Clock Networks | 4 | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| 工作温度 | 0C to +85C (commercial) | 0 °C to +85 °C (Commercial, "C" grade) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant | Compliant (Pb-free "G" suffix) |
| MSL 等级 | 3 (168 hours) | — |
| Family | — | MAX 10 |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | 46 (378 Kbits) |
| User Flash Memory | — | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | — | 178 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| 18 × 18 Multipliers | — | 24 |
| Internal Oscillator | — | Yes (on-chip) |