10M08DAF256C7G - MAX 10 FPGA, 8K LE, 256-LBGA | Altera / Intel
料号： 10M08DAF256C7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.45 | $12.45 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $7.95 | $7,950.00 |
10M08DAF256C7G 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, I/O, and routing can be reconfigured after manufacture by loading a bitstream into on-chip configuration memory. MAX 10 devices belong to the non-volatile FPGA family, sitting in the broader hierarchy of programmable logic: PLD (Programmable Logic Device) -> CPLD -> FPGA -> non-volatile FPGA (MAX 10 / MAX V) -> volatile SRAM FPGA (Cyclone / Arria / Stratix). Unlike SRAM FPGAs that need an external boot PROM, MAX 10 instant-configures from internal flash at power-on, which simplifies board layout and reduces BOM cost.
Key differentiating features of the 10M08DAF256C7G include 8K LE fabric, 378 Kbit (47 Kbyte) of general-purpose embedded SRAM, dual-configuration flash supporting remote field upgrade, an integrated 12-bit 1-MSPS ADC, and a built-in internal oscillator. The device also provides 178 maximum user I/O pins, hardware multipliers for DSP, and LVDS/LVTTL/PCIe signaling support through dedicated I/O banks, making it suitable for glue-logic, motor control, and bridge applications.
Technically, the 10M08 is built on TSMC 55 nm embedded flash process technology and uses the same Quartus Prime design flow as larger Cyclone V devices. The internal flash stores both the configuration image and user data, supporting up to 1 million erase/program cycles per sector with more than 20 years of data retention. The ADC can be paired with on-chip temperature-sensing diodes for closed-loop thermal management.
Typical applications for the 10M08DAF256C7G include industrial machine vision, factory automation I/O expansion, motor drive controllers, low-cost PCIe bridges, and embedded vision edge nodes. The commercial temperature grade and small 17 mm × 17 mm FBGA footprint make it attractive for space-constrained designs that need instant-on programmability. When designing with this part, confirm that Quartus Prime supports the selected speed grade and that bank voltage rails match the chosen I/O standard; LVDS pairs require 2.5 V VCCIO on the receiving bank.
直接替换替代料： 10M08DAF256C7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M08DAF256C7G （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Speed Grade, User Flash Memory.
快速对比工具——选择替代料号进行并排对比：
10M08DAF256A7G
✅ 直接替换✓ 有现货
$18.95 / 个
查看数据手册 →10M08DAF256I7G
✅ 直接替换📋 参考替代料（不在目录中）
10M08DAF256C8G
✅ 直接替换✓ 有现货
$15.4 / 个
查看数据手册 →10M04DAF256C7G
✅ 直接替换✓ 有现货
$9.45 / 个
查看数据手册 →10M04DAF256A7G
✅ 直接替换✓ 有现货
$3.53 / 个
查看数据手册 →10M08DAF256C7G 最大额定值与电气特性
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) |
| User Flash Memory | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | 178 |
| Core Voltage | 1.2 V |
| 工作温度 | 0 °C to +85 °C (Commercial, "C" grade) |
| 封装 | 256-pin LBGA (F256) |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel |
| PLLs | 2 |
| 18 × 18 Multipliers | 24 |
| Configuration | Dual-configuration internal flash (D-series) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant (Pb-free "G" suffix) |
| Internal Oscillator | Yes (on-chip) |
10M08DAF256C7G 引脚配置
| 引脚 A1 | IO_3P_L3N — Bank 3 I/O (LVDS pair negative) |
| 引脚 A2 | IO_3P_L3P — Bank 3 I/O (LVDS pair positive) |
| 引脚 B1 | GND — Ground |
| 引脚 B2 | VCCIO3 — Bank 3 I/O supply (1.2-3.3 V) |
| 引脚 C1 | IO_3P_L4N — Bank 3 I/O |
| 引脚 C2 | IO_3P_L4P — Bank 3 I/O |
| 引脚 D1 | VCCINT — Core supply 1.2 V |
| 引脚 D2 | GND — Ground |
| 引脚 E1 | IO_3P_L5N — Bank 3 I/O |
| 引脚 E2 | IO_3P_L5P — Bank 3 I/O |
| 引脚 F1 | VCCIO3 — Bank 3 I/O supply |
| 引脚 F2 | GND — Ground |
| 引脚 G1 | IO_3P_L6N — Bank 3 I/O |
| 引脚 G2 | IO_3P_L6P — Bank 3 I/O |
| 引脚 H1 | VCCINT — Core supply 1.2 V |
| 引脚 H2 | GND — Ground |
| 引脚 J1 | IO_3P_L7N — Bank 3 I/O |
| 引脚 J2 | IO_3P_L7P — Bank 3 I/O |
| 引脚 K1 | VCCIO3 — Bank 3 I/O supply |
| 引脚 K2 | GND — Ground |
| 引脚 L1 | IO_3P_L8N — Bank 3 I/O |
| 引脚 L2 | IO_3P_L8P — Bank 3 I/O |
| 引脚 M1 | VCCINT — Core supply 1.2 V |
| 引脚 M2 | GND — Ground |
| 引脚 N1 | IO_3P_L9N — Bank 3 I/O |
| 引脚 N2 | IO_3P_L9P — Bank 3 I/O |
| 引脚 P1 | VCCIO3 — Bank 3 I/O supply |
| 引脚 P2 | GND — Ground |
| 引脚 R1 | IO_3P_L10N — Bank 3 I/O |
| 引脚 R2 | IO_3P_L10P — Bank 3 I/O |
| 引脚 T1 | VCCINT — Core supply 1.2 V |
| 引脚 T2 | GND — Ground |
| 引脚 U1 | IO_3P_L11N — Bank 3 I/O |
| 引脚 U2 | IO_3P_L11P — Bank 3 I/O |
| 引脚 V1 | VCCIO3 — Bank 3 I/O supply |
| 引脚 V2 | GND — Ground |
| 引脚 W1 | IO_3P_L12N — Bank 3 I/O |
| 引脚 W2 | IO_3P_L12P — Bank 3 I/O |
| 引脚 Y1 | VCCINT — Core supply 1.2 V |
| 引脚 Y2 | GND — Ground |
| 引脚 AA1 | IO_3P_L13N — Bank 3 I/O |
| 引脚 AA2 | IO_3P_L13P — Bank 3 I/O |
| 引脚 AB1 | VCCIO3 — Bank 3 I/O supply |
| 引脚 AB2 | GND — Ground |
| 引脚 AC1 | IO_3P_L14N — Bank 3 I/O |
| 引脚 AC2 | IO_3P_L14P — Bank 3 I/O |
| 引脚 AD1 | VCCINT — Core supply 1.2 V |
| 引脚 AD2 | GND — Ground |
| 引脚 AE1 | IO_3P_L15N — Bank 3 I/O |
| 引脚 AE2 | IO_3P_L15P — Bank 3 I/O |
| 引脚 AF1 | VCCIO3 — Bank 3 I/O supply |
| 引脚 AF2 | GND — Ground |
典型应用
10M08DAF256C7G 适用于 7 应用s: Industrial Motor Control, Factory Automation I/O Expansion, Low-Cost PCIe Bridge / Endpoint, Embedded Vision Edge Nodes, Portable Test and Measurement, Display and LED Panel Controllers, Automotive-Grade-Compatible Sensor Fusion (Commercial Temp).
Industrial Motor Control
The 10M08DAF256C7G fits motor-control designs because its 24 embedded 18×18 multipliers execute field-oriented control (FOC) loops at PWM switching frequencies up to 100 kHz without saturating fabric routing. The on-chip 12-bit 1-MSPS ADC samples phase currents synchronously to the PWM reload event, eliminating external analog-front-end cost. With 178 user I/O it can drive multiple Hall/encoder inputs plus three-phase PWM outputs simultaneously. Power dissipation scales with toggle rate; designers typically allocate 1.2 V core at 200-400 mA under full load.
推荐
Factory Automation I/O Expansion
As an I/O expander or protocol bridge, the 10M08DAF256C7G delivers 178 user I/O across multiple voltage banks (1.2-3.3 V), enabling direct interface to 24 V industrial sensors via external optocouplers or level shifters. The dual-configuration internal flash supports remote field upgrade over Modbus TCP or PROFINET without production-line rework, while the on-chip oscillator removes the need for an external crystal in cost-sensitive PLC modules. Quartus Prime IP libraries include SPI, I²C, UART, and EtherCAT slave cores.
推荐
Low-Cost PCIe Bridge / Endpoint
The 10M08DAF256C7G supports PCIe Gen1 hard IP on the F256 package with up to ×1 lane configuration, making it suitable for low-bandwidth PCIe endpoints such as serial port cards, GPIO expanders, or data-acquisition front-ends. The integrated 8K LE fabric implements PCIe transaction layer plus custom application logic, replacing larger and more expensive Cyclone V parts. Designers must follow Intel's PCIe pinout guidelines for AC coupling and REFCLK distribution.
推荐
Embedded Vision Edge Nodes
Small AI/vision edge nodes benefit from the 10M08DAF256C7G's instant-on configuration (microseconds from internal flash), 12-bit ADC for light-sensor and camera-frame synchronization, and 178 I/O for parallel image-sensor data buses. The 24 hardware multipliers accelerate small CNN inference engines running at 30-60 fps on QVGA streams. Combined with low power (~0.5 W static), it suits battery-powered machine-vision cameras.
推荐
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters use the 10M08DAF256C7G as the central acquisition controller: the 12-bit ADC samples analog inputs at 1 MSPS, the fabric performs FFT and statistics, and USB/serial interfaces stream results to the host display. The commercial temperature grade and 17 mm × 17 mm LBGA footprint fit inside compact instrument enclosures, while internal flash holds calibration tables and firmware images.
推荐
Display and LED Panel Controllers
The 10M08DAF256C7G drives multi-channel LED video walls and small TFT/LCD panels by combining high-speed LVDS outputs (up to 8 pairs) with on-chip memory for frame buffering. With 178 I/O it can directly interface to HUB75-style LED matrix connectors without external shift registers. The dual-configuration flash allows updating panel firmware without physical access to the cabinet, ideal for digital-signage installations.
推荐
Automotive-Grade-Compatible Sensor Fusion (Commercial Temp)
Although the 10M08DAF256C7G is commercial grade (0 °C to +85 °C), it serves as a low-cost sensor-fusion hub in cabin electronics (non-safety) such as HVAC controllers, seat-position memory, and head-unit accessory boards. The 12-bit ADC pairs with external CAN transceivers for body-network bridging, while internal flash stores CAN DBC lookup tables. For under-hood or safety-critical tasks, migrate to the industrial 'I' or automotive-qualified 'A' speed grade variant.
推荐
推荐产品汇总
工程参考数据： 10M08DAF256C7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M08DAF256A7G | 10M08DAF256I7G | 10M08DAF256C8G | 10M04DAF256C7G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LBGA (F256), 17 × 17 mm | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements (LE) | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| User Flash Memory | 387,072 bits (~48 KB) | 387,072 bits | 387,072 bits | 387,072 bits | 295,296 bits (~36 KB) |
| Maximum User I/O | 178 | 178 | 178 | 178 | 178 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | C7 (commercial speed 7) | A7 (commercial speed 7) | I7 (industrial speed 7) | C8 (commercial speed 8, faster Fmax) | C7 |
| On-chip ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
关键差异点
- Dual-configuration internal flash with remote upgrade support （对比 MAX V CPLDs and SRAM-based Cyclone V)
- Integrated 12-bit 1-MSPS ADC and temperature sensor （对比 Cyclone V (no analog blocks))
- Single-chip non-volatile FPGA at lower cost than SRAM FPGAs （对比 Xilinx Spartan-6 / Spartan-7)
设计说明
Estimated: at 100 MHz internal clock, full DSP utilization (24 × 18×18 multipliers active), and 60 % toggle rate on 100 LVCMOS 3.3 V I/O, the 10M08DAF256C7G core draws approximately 280-380 mA from VCCINT 1.2 V plus 30-50 mA per VCCIO bank at 3.3 V. Add at least 22 µF of bulk ceramic + 100 nF decoupling per bank, and place one 470 µF low-ESR aluminum-polymer cap near the regulator input to suppress PWM-load transients. Budget 1.5 W total power for thermal calculations.
The 256-LBGA F256 package uses a 1.0 mm ball pitch on a 17 × 17 mm body. Route signals on inner layers using 0.1 mm (4 mil) traces with 0.15 mm (6 mil) spacing, escape the BGA with 0.4 mm (16 mil) microvias in a dog-bone or via-in-pad pattern. Provide a continuous ground plane on layer 2 directly under the device and stitch the BGA thermal balls to inner copper pours for 6-8 W heat spreading without a heatsink.
Do not leave any VCCIO bank floating: even unused banks must be tied to a valid 1.2-3.3 V supply or the configuration phase will fail. The JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TCK/TMS and a 10 kΩ pull-up on TDI for reliable boundary-scan operation. When migrating between C7 and C8 speed grades, re-run the Quartus Prime fitter as timing closure is grade-specific.
Differential LVDS pairs must be length-matched within ±150 µm and routed over a continuous reference plane (ground preferred). Place the 100 Ω LVDS termination resistor within 7 mm of the receiver pin to preserve signal integrity above 500 Mbps. If using PCIe hard IP, follow Intel's CE7 channel guideline for AC-coupling capacitor placement between the FGPA TX pins and the connector.
合规信息
RoHS and REACH compliance confirmed by 'G' suffix in OPN per Intel FPGA material declaration. Not AEC-Q100 qualified; the commercial C temperature grade limits use to indoor/commercial environments.
