10M08DCF484C8G vs 10M08DAF484I7G 对比

详细并排对比 10M08DCF484C8G 出自 Intel 和 10M08DAF484I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M08DCF484C8G 10M08DCF484C8G - MAX 10 FPGA, 8K LEs, 484-BGA | Intel

10M08DCF484C8G - MAX 10 FPGA, 8K LEs, 484-BGA | Intel

10M08DCF484C8G ✓ 量产中
Intel
10M08DAF484I7G 10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G ✓ 量产中

规格对比

参数 10M08DCF484C8G 10M08DAF484I7G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $19.80 $25.80
Family MAX 10 MAX 10 FPGA
Logic Elements 8,000 —
Embedded Memory (M9K) 378 Kbits (49 M9K blocks) —
Embedded Multiplier Blocks (18x18) [DATA_NEEDED: 18x18 multiplier count] —
User I/O Count 250 —
封装 484-ball FBGA (FineLine BGA) —
Speed Grade C8 (commercial, standard speed) —
Process Technology 55 nm TSMC embedded NOR flash 55 nm
Core Voltage 1.2 V (on-chip regulator) —
Configuration Memory Dual on-chip flash (instant-on, dual-boot) Internal flash (non-volatile)
PLLs 2 —
Global Clock Networks Up to 16 —
Integrated ADC 12-bit SAR, up to 1 Msps —
LVDS Support True LVDS up to 1.4 Gbps (input), emulated LVDS (output) —
工作温度 Commercial (0C to +85C junction, per speed grade) -40 °C to +100 °C (Industrial)
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 3 (per JEDEC J-STD-020) —
RoHS 状态 Compliant Compliant
Series — MAX 10
Logic Elements (LE) — 8000
Embedded Memory (bits) — 387072
Embedded Memory (Kb) — 378
Number of I/Os — 250
Number of LABs/CLBs — [DATA_NEEDED: number of LABs]
Number of Logic Array Blocks — [DATA_NEEDED: LAB count]
Supply Voltage - Core — 1.2 V
封装 / 外壳 — 484-BGA
Supplier Device Package — 484-FBGA (23x23 mm)
Lead Free — Yes

数据手册与资源

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