10M50DAF484I7G vs 10M50DCF484I7G 对比
详细并排对比 10M50DAF484I7G 出自 Intel 和 10M50DCF484I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M50DAF484I7G | 10M50DCF484I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $58.20 | $99.60 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| 封装 | 484-ball FBGA (F484) | 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | TSMC 55 nm embedded flash |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | 12-bit, up to 17 channels, 1 MSPS |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Configuration Mode | Single-chip (no external boot device required) | On-chip flash + JTAG |
| 安装类型 | Surface Mount (FBGA) | Surface Mount (BGA) |
| MSL 等级 | 3 (per JEDEC J-STD-020) | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Logic Elements | — | 50,000 |
| Embedded SRAM | — | 1,677,312 bits (1.6 Mb) |
| User Flash Memory | — | Up to 5,888 Kb (on-chip dual configuration) |
| Maximum User I/O Pins | — | 360 |
| LVDS Channels (dedicated) | — | 160 (rx + tx) |
| 18x18 Hardware Multipliers | — | 144 |
| Core Voltage | — | 1.2 V (internal) |
| 工作结温 | — | -40C to +100C (industrial, 'I' suffix) |
| Speed Grade | — | 7 (fastest commercial/industrial) |