A3PE3000-2FG324I vs A3PE3000-2FGG324 对比

详细并排对比 A3PE3000-2FG324I 出自 Microchip Technology 和 A3PE3000-2FGG324 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ 量产中
Microchip Technology
A3PE3000-2FGG324 A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 ✓ 量产中

规格对比

参数 A3PE3000-2FG324I A3PE3000-2FGG324
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $216.00
Manufacturer Microchip Technology (Microsemi) —
Family ProASIC3E ProASIC3E
Logic Elements (LEs) 35000 LEs —
System Gates 3M gates 3000000
Maximum System Performance 310 MHz —
Process Technology 130 nm flash 130 nm CMOS flash
Core Supply Voltage 1.5 V 1.5 V
Number of I/Os 221 I/O —
封装 / 外壳 324-Ball FBGA —
安装方式 SMD/SMT —
Operating Temperature (Min) -40 C —
Operating Temperature (Max) +85 C —
Speed Grade -2 2
Temperature Grade Industrial (I) —
Configuration Memory Non-volatile Flash (single chip) Flash (single-chip, instant-on)
Packaging Tray —
Product Series A3PE3000 —
Logic Cells — 75264
CLBs — 75264
Maximum System Frequency — 310 MHz
User I/O — 221
Total Memory Bits — [DATA_NEEDED: embedded SRAM capacity]
封装 — 324-ball FBGA (FGG324)
Package Dimensions — 19 x 19 mm, 1 mm pitch, 1.63 mm height
安装类型 — Surface Mount
工作温度 — [DATA_NEEDED: operating temperature range]
Packaging Type — Tray
RoHS 状态 — Green (RoHS compliant)
Automotive Qualification — Not qualified (standard grade)

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