A3PE3000L-FG484M vs A3PE3000L-FGG484M 对比

详细并排对比 A3PE3000L-FG484M 出自 Microchip Technology 和 A3PE3000L-FGG484M 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000L-FG484M A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M ✓ 量产中
Microchip Technology
A3PE3000L-FGG484M A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip

A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip

A3PE3000L-FGG484M ✓ 量产中

规格对比

参数 A3PE3000L-FG484M A3PE3000L-FGG484M
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $129.00 $298.00
Family ProASIC3L (Flash-based FPGA) ProASIC3L (ProASIC3 Low Power)
System Gates 3000000 (3.00E6) 3000000
Logic Elements (VersaTiles) 75264 —
True Dual-Port SRAM 504 kbits —
User I/O 341 (up to 616 in larger packages) —
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V
Process Technology 130-nm, 7-layer metal (6 copper) flash-based CMOS —
Logic Family CMOS —
Configuration Memory Nonvolatile on-chip flash, live at power-up (Level 0) —
Low-Power Feature Flash*Freeze technology —
工作温度 0 to 70 C —
电源电压 1.5 V —
Package Type FBGA-484, 1 mm pitch, 23 x 23 mm —
Pins / Balls 484 —
安装类型 Surface Mount —
Single-Chip Solution Yes (no external configuration device required) —
Logic Elements / Cells — 75264
Number of I/Os — 341
Embedded Memory — 516096 bits
安装方式 — SMD/SMT
封装 / 外壳 — FBGA-484 (FGG484)
Package Dimensions — 23 x 23 mm, 2.23 mm height, 1.0 mm pitch
Minimum Operating Temperature — -55 C
Maximum Operating Temperature — +125 C
Temperature Grade — Military (M suffix)
Technology — Flash-based, non-volatile, Flash*Freeze
Packaging — Tray
RoHS 状态 — Compliant
Terminal Form — Ball
Product Series — A3PE3000L

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