A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip
料号： A3PE3000L-FGG484M ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $395 | $395.00 |
| 10 | $375.2 | $3,752.00 |
| 100 | $348 | $34,800.00 |
| 500 | $322.5 | $161,250.00 |
| 1,000 | $298 | $298,000.00 |
A3PE3000L-FGG484M 概述
A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, it sits as an FPGA -> programmable logic device -> semiconductor. Unlike SRAM FPGAs, ProASIC3L devices are single-chip, instant-on, and inherently more secure because the bitstream is stored internally.
Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, Flash*Freeze technology that dramatically cuts static power while retaining state, and per the Microchip datasheet roughly 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device. The non-volatile flash fabric eliminates configuration PROMs, reduces bill-of-material cost, and improves supply-chain security.
The A3PE3000L fabric provides versatile logic elements, embedded SRAM, and supports soft-core processors and common IP cores. The 23 x 23 mm, 1.0 mm pitch FGG484 package with 2.23 mm height suits high-I/O-count designs where board area and solderable inspection matter.
Typical applications include military and aerospace systems needing -55C to +125C operation, industrial automation controllers, communications line cards, and medical instrumentation where low static power extends battery or conduction-cooled system budgets.
Design consideration: allocate adequate decoupling on the 1.2V/1.5V core rails and plan the power-up sequence early; Flash*Freeze pin usage should be fixed before layout freeze.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
直接替换替代料： A3PE3000L-FGG484M ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000L-FGG484M （相同外形与封装尺寸） ——差异在于 Family, Process Technology, Package, System Gates, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
M1A3PE3000L-FGG484M
✅ 直接替换📋 参考替代料（不在目录中）
A3PE3000L-FGG484
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000L-1FGG484I
✅ 直接替换✓ 有现货
$104.5 / 个
查看数据手册 →A3PE3000L-FG484M
✅ 直接替换✓ 有现货
$129 / 个
查看数据手册 →A3PE3000L-1FG484I
✅ 直接替换✓ 有现货
$89.9 / 个
查看数据手册 →A3PE3000L-FGG484M 最大额定值与电气特性
| Family | ProASIC3L (ProASIC3 Low Power) |
| Logic Elements / Cells | 75264 |
| System Gates | 3000000 |
| Number of I/Os | 341 |
| Embedded Memory | 516096 bits |
| Core Voltage | 1.2 V to 1.5 V |
| 安装方式 | SMD/SMT |
| 封装 / 外壳 | FBGA-484 (FGG484) |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1.0 mm pitch |
| Minimum Operating Temperature | -55 C |
| Maximum Operating Temperature | +125 C |
| Temperature Grade | Military (M suffix) |
| Technology | Flash-based, non-volatile, Flash*Freeze |
| Packaging | Tray |
| RoHS 状态 | Compliant |
| Terminal Form | Ball |
| Product Series | A3PE3000L |
A3PE3000L-FGG484M 23 x 23 mm, 2.23 mm height, 1.0 mm pitch 引脚配置指南
A3PE3000L-FGG484M（23 x 23 mm, 2.23 mm height, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000L-FGG484M.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000L-FGG484M 适用于 6 应用s: Military and Aerospace Systems, Industrial Automation Controllers, Communications Line Cards, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Control.
Military and Aerospace Systems
The -55C to +125C military temperature rating of the A3PE3000L-FGG484M makes it directly suited to defense electronics such as avionics controllers, radar interface boards, and missile guidance subsystems. The 3M-gate fabric with 341 I/Os absorbs glue logic, bus interfaces, and sensor preprocessing in a single 23 x 23 mm package, while the non-volatile flash fabric delivers instant-on operation with no configuration PROM - a key reliability advantage in systems with tight power-sequencing windows. Flash*Freeze mode cuts static power substantially while retaining register and memory state, useful in event-driven payloads that idle between bursts. Designs should recompile bitstreams in Libero SoC and verify conduction-cooling thermal margins at the +125C junction limit.
推荐
Industrial Automation Controllers
In factory automation and motion-control backplanes, the A3PE3000L-FGG484M consolidates deterministic I/O handling, encoder interpolation, and fieldbus interfacing into one flash FPGA. Its 1.2V to 1.5V core voltage lowers switching losses, and per the Microchip datasheet the L family cuts dynamic power about 40% versus the standard ProASIC3, reducing cabinet heat in sealed enclosures. The 341 user I/Os drive multiple isolated I/O banks at 3.3V and mixed voltages, while 516 kbit of embedded memory buffers process data without external SRAM. Single-chip flash configuration eliminates the config PROM, improving uptime in vibration-prone environments. Use the FGG484 footprint for consistent reflow assembly with lead-free processes.
推荐
Communications Line Cards
Telecom and datacom line cards benefit from the A3PE3000L's combination of fabric density and I/O count: 341 user I/Os map cleanly to multi-port backplane interfaces, Serdes-adjacent glue logic, and LED or alarm aggregation. The high PSRR-friendly 1.5V core simplifies power-tree design behind point-of-load converters, and Flash*Freeze lets standby line cards drop static power roughly 50% versus equivalent ProASIC3 silicon while preserving state for fast reactivation. Non-volatile configuration means a card can enumerate within microseconds of hot-swap insertion, simplifying redundant-architecture bring-up. Designers should verify I/O banking rules in the DS50003268 datasheet against backplane voltage standards before pin freezing.
推荐
Medical Instrumentation
Diagnostic imaging front ends, patient-monitoring bases, and laboratory analyzers use the A3PE3000L-FGG484M to time acquisitions, preprocess sensor streams, and manage display and communication interfaces. The flash fabric powers up instantly with no external configuration, shortening instrument boot time - a user-visible benefit in clinical workflows. Low static power, further reduced by Flash*Freeze between scans, extends the thermal and battery budget of portable and bedside units. The 23 x 23 mm FGG484 package with 1.0 mm pitch supports standard surface-mount assembly used in medical manufacturing. Note that the M temperature grade exceeds typical medical requirements; the industrial A3PE3000L-1FGG484I on the same footprint is usually the more economical pick for this sector.
推荐
Test and Measurement Equipment
Bench instruments, automated test fixtures, and protocol analyzers exploit the A3PE3000L's reprogrammability and abundant I/O for pattern generation, capture buffering, and DUT interface adaptation. Embedded flash memory (516,096 bits) implements small lookup tables and configuration snapshots locally, while the fabric's low dynamic power keeps thermal noise contributions predictable in sensitive analog signal chains. Instant-on flash configuration means instruments are measurement-ready in under a typical USB-enumeration interval. The 484-ball package provides ample power and ground balls for low-inductance distribution to fast I/O banks. Instrument makers commonly dual-source the FGG484 and FG484M ball-finish variants across production sites - confirm RoHS requirements per region before qualifying the FG lead-finish options.
推荐
Secure Embedded Control
Applications that must protect design IP - such as encryption key handling modules, license-control dongles, and proprietary industrial controllers - benefit from the A3PE3000L's non-volatile flash bitstream storage. Because the configuration lives on-chip, there is no external bitstream to intercept at power-up, a structural security advantage over SRAM FPGAs. The -55C to +125C M grade extends deployment to harsh outdoor and vehicle-mounted controllers. Designers can partition sensitive logic in the 75,264-cell fabric while using the 341 I/Os for tamper-detection loops and multi-voltage sensor interfaces. Follow Microchip security application notes for flash-lock and design-readback-disable settings, and recompile with current Libero SoC releases to carry latest security fixes.
推荐
推荐产品汇总
工程参考数据： A3PE3000L-FGG484M ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M1A3PE3000L-FGG484M | A3PE3000L-FGG484 | A3PE3000L-1FGG484I | A3PE3000L-FG484M | A3PE3000L-1FG484I |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (FGG484), 23 x 23 mm, 1.0 mm pitch | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FG484) - same footprint, lead-finish variant | FBGA-484 (FG484) - same footprint, lead-finish variant |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology (M1 rebrand) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates / Cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells |
| User I/Os | 341 | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | Yes | Yes |
| RoHS / Lead Finish | RoHS compliant (GGG lead-free balls) | Yes (GGG) | Yes (GGG) | Yes (GGG) | Non-RoHS FG finish per Xecor comparison | Non-RoHS FG finish |
关键差异点
- Military temperature range in the same FGG484 footprint （对比 A3PE3000L-1FGG484I)
- ~40% lower dynamic and ~50% lower static power than ProASIC3 （对比 A3PE3000-FGG484)
- Dual-sourcing via M1 rebrand （对比 M1A3PE3000L-FGG484M)
设计说明
Provide independent, well-decoupled 1.2V and 1.5V core rails plus I/O bank supplies (typically 3.3V/2.5V/1.8V per bank). Use at least 10uF bulk plus 0.1uF ceramic per power ball group, placed within 2 mm of the ball via. Verify power-on ramp rates against the DS50003268 datasheet power-up requirements; the non-volatile flash fabric means the device becomes active immediately, so I/O banks must be valid before or with the core to prevent bus contention during hot insertion. Use Microchip's power calculator to estimate static and dynamic current before selecting regulators, and account for Flash*Freeze entry/exit current transients.
The FGG484 is a 1.0 mm pitch, 23 x 23 mm BGA; standard 0.5 mm via-in-pad with via filled and capped, or dog-bone fanout on 1.0 mm pitch, both work. Plan at least four signal layers plus two dedicated planes for a comfortable 341-I/O breakout. Solder mask-defined vs non-solder-mask-defined pads must match Microchip's land-pattern recommendation to ensure reliable ball wetting. For the military M grade, specify X-ray inspection of BGA joints per your quality process, and store trays per MSL rating before reflow - bake if the floor-life clock is exceeded.
Three recurring mistakes: (1) copying the pinout from an A3PE3000 (non-L) datasheet - verify against the ProASIC3L FGG484 table in DS50003268; (2) leaving the Flash*Freeze pin floating or mis-assigned, which either blocks low-power entry or causes unintended state retention behavior - assign it deliberately in Libero before layout freeze; (3) assuming the FG and FGG suffixes are interchangeable - they differ in ball lead finish (RoHS), which matters for procurement and process qualification even though the electrical pinout is identical. Always recompile the design for the exact target MPN and speed grade.
合规信息
RoHS Code 'Yes' per Xecor comparison data for the FGG484M variant; the FG (non-GGG) ball-finish siblings are flagged non-RoHS in the same source. REACH, halogen-free, and conflict-minerals status not stated in provided data.
