A3PE3000L-FGG484M vs A3PE3000L-FGG484 对比

详细并排对比 A3PE3000L-FGG484M 出自 Microchip Technology 和 A3PE3000L-FGG484 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000L-FGG484M A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip

A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip

A3PE3000L-FGG484M ✓ 量产中
Microchip Technology
A3PE3000L-FGG484 A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 ✓ 量产中

规格对比

参数 A3PE3000L-FGG484M A3PE3000L-FGG484
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $298.00 $0.00
Family ProASIC3L (ProASIC3 Low Power) ProASIC3L (Low Power Flash FPGA)
Logic Elements / Cells 75264 —
System Gates 3000000 3,000,000
Number of I/Os 341 —
Embedded Memory 516096 bits —
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V
安装方式 SMD/SMT —
封装 / 外壳 FBGA-484 (FGG484) —
Package Dimensions 23 x 23 mm, 2.23 mm height, 1.0 mm pitch —
Minimum Operating Temperature -55 C —
Maximum Operating Temperature +125 C —
Temperature Grade Military (M suffix) —
Technology Flash-based, non-volatile, Flash*Freeze —
Packaging Tray Tray
RoHS 状态 Compliant Compliant (per Newark: RoHS Compliant: Yes)
Terminal Form Ball —
Product Series A3PE3000L —
Logic Cells — 75,264
User I/O — 341
Embedded RAM — 516,096 bits
Process Technology — 130 nm flash
Configuration Technology — Nonvolatile flash, Instant On
Low Power Feature — Flash*Freeze technology
封装 — 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch
安装类型 — Surface Mount
工作温度 — [DATA_NEEDED: operating temperature range]
Supply Voltage - I/O — [DATA_NEEDED: I/O bank voltage range]
Security — Single-chip, flash-based, secure nonvolatile configuration

数据手册与资源

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