AFS600-1FG256I vs M7AFS600-FGG256I 对比

详细并排对比 AFS600-1FG256I 出自 Microchip Technology 和 M7AFS600-FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
AFS600-1FG256I AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256I ✓ 量产中
Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ 量产中

规格对比

参数 AFS600-1FG256I M7AFS600-FGG256I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type Fusion mixed-signal field-programmable gate array (FPGA) —
System Gates 600,000 gates 600K
Logic Family Flash-based CMOS —
I/O Count 119 I/O —
电源电压 1.5 V —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 layers —
封装 256-LBGA, 1 mm pitch 256-LBGA (FBGA), 1 mm ball pitch
引脚数量 256 pins —
工作温度 0°C to 85°C —
Configuration Memory Nonvolatile flash —
Power-Up Behavior Live at power-up (LAPU) —
Integrated Resources Configurable analog, large flash memory blocks, clock generation and management —
Programmable Logic High-performance flash-based programmable logic —
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Junction Test Temperature 100°C —
Family — Fusion Mixed-Signal FPGA
User I/O — 119
Core Voltage — 1.5 V
Maximum System Frequency — 1098.9 MHz (per distributor parametric listing)
Embedded Processor — ARM CoreMP7
Fabric Type — Flash-based, non-volatile, instant-on
Analog Subsystem — Integrated configurable analog (per Microchip Fusion family page)
On-chip Flash Memory — Yes (large flash memory blocks, per Microchip Fusion family page)
Clock Management — Integrated clock generation and management circuitry (PLLs)
Temperature Grade — Industrial (I suffix)
工作温度范围 — -40C to +85C (industrial grade standard range)
安装类型 — Surface Mount
Packaging — Tray
MSL 等级 — [DATA_NEEDED: MSL Level]
Thermal Resistance (theta_JA) — [DATA_NEEDED: Thermal Resistance]

数据手册与资源

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