AFS600-2FGG256 vs M7AFS600-FG256I 对比
详细并排对比 AFS600-2FGG256 出自 Microchip Technology 和 M7AFS600-FG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ 量产中规格对比
| 参数 | AFS600-2FGG256 | M7AFS600-FG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Product Type | Fusion mixed-signal FPGA | — |
| System Gates | Approximately 600,000 gates | 600K |
| Configurable Logic Blocks | 13,824 CLBs | — |
| Reported Logic Elements | 7,000 LE | — |
| Number of I/O | 119 I/O | 119 I/O |
| 封装 | 256-LBGA | — |
| Package Pin Count | 256 balls | — |
| Package Pitch | 1.0 mm | — |
| 工作电源电压 | 1.5 V | — |
| 工作温度 | 0°C to +70°C | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Feature | Live at Power-Up | — |
| Maximum DDR Data Rate | 700 Mbps | — |
| I/O Features | Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down | — |
| 安装类型 | SMD/SMT | — |
| Packaging | Tray | Tray |
| RoHS 状态 | RoHS compliant | — |
| Lead-Free Status | Lead free | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| 封装 / 外壳 | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| 安装方式 | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |