AFS600-FGG256 vs M1AFS600-2FG256 对比

详细并排对比 AFS600-FGG256 出自 Microchip Technology 和 M1AFS600-2FG256 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
AFS600-FGG256 AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 Unknown
Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ 量产中

规格对比

参数 AFS600-FGG256 M1AFS600-2FG256
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Unknown 有效
Device Type Fusion mixed-signal FPGA —
System Gates 600,000 gates 600000 gates
Configurable Logic Cells 13,824 cells —
I/O Count 119 I/Os —
电源电压 1.5 V —
Logic Family CMOS —
Process Technology 130 nm —
Metal Layers 7 layers —
Configuration Memory Flash-based nonvolatile memory —
Configuration Feature Live at Power-Up (LAPU) —
最大时钟频率 1098.9 MHz —
工作温度 0°C to 70°C —
Package Type 256-pin FBGA —
Package Pitch 1.0 mm —
安装类型 Surface mount —
Packing Media Tray —
RoHS Compliant —
Series — M1AFS600 (Fusion)
Logic Elements — 110592
Embedded Processor — ARM Cortex-M1
Number of I/Os — 119 I/O
Core Supply Voltage — 1.5 V
Technology — 130 nm flash-based
封装 / 外壳 — 256-LBGA (FBGA-256)
安装方式 — SMD/SMT
Operating Temperature - Minimum — 0 C
Operating Temperature - Maximum — +70 C
Packaging — Tray
Analog Peripherals — Configurable analog block (Fusion mixed-signal)
On-chip Memory — Large flash memory blocks
Clock Management — On-chip clock generation and management (PLL)
Configuration — Flash-based, live at power-up, no external config PROM required
RoHS 状态 — [DATA_NEEDED: RoHS status]
Maximum Operating Frequency — [DATA_NEEDED: maximum fabric operating frequency]

数据手册与资源

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