AFS600-FGG256 vs M1AFS600-2FG256 비교

다음의 상세 나란히 비교: AFS600-FGG256 제조: Microchip Technology 및 M1AFS600-2FG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
AFS600-FGG256 AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 Unknown
Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ 활성

사양 비교

파라미터 AFS600-FGG256 M1AFS600-2FG256
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Unknown 활성
Device Type Fusion mixed-signal FPGA —
System Gates 600,000 gates 600000 gates
Configurable Logic Cells 13,824 cells —
I/O Count 119 I/Os —
공급 전압 1.5 V —
Logic Family CMOS —
Process Technology 130 nm —
Metal Layers 7 layers —
Configuration Memory Flash-based nonvolatile memory —
Configuration Feature Live at Power-Up (LAPU) —
최대 클록 주파수 1098.9 MHz —
동작 온도 0°C to 70°C —
Package Type 256-pin FBGA —
Package Pitch 1.0 mm —
실장 유형 Surface mount —
Packing Media Tray —
RoHS Compliant —
Series — M1AFS600 (Fusion)
Logic Elements — 110592
Embedded Processor — ARM Cortex-M1
Number of I/Os — 119 I/O
Core Supply Voltage — 1.5 V
Technology — 130 nm flash-based
패키지 / 케이스 — 256-LBGA (FBGA-256)
장착 스타일 — SMD/SMT
Operating Temperature - Minimum — 0 C
Operating Temperature - Maximum — +70 C
Packaging — Tray
Analog Peripherals — Configurable analog block (Fusion mixed-signal)
On-chip Memory — Large flash memory blocks
Clock Management — On-chip clock generation and management (PLL)
Configuration — Flash-based, live at power-up, no external config PROM required
RoHS 상태 — [DATA_NEEDED: RoHS status]
Maximum Operating Frequency — [DATA_NEEDED: maximum fabric operating frequency]

데이터시트 & 자료

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