ATSAMA5D24B-CU vs ATSAMA5D26B-CN 对比
详细并排对比 ATSAMA5D24B-CU 出自 Microchip Technology 和 ATSAMA5D26B-CN 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAMA5D24B-CU - 500MHz ARM Cortex-A5 MPU, 256-TFBGA | Microchip
ATSAMA5D24B-CU ✓ 量产中Microchip Technology
ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA
ATSAMA5D26B-CN ✓ 量产中规格对比
| 参数 | ATSAMA5D24B-CU | ATSAMA5D26B-CN |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10.42 | $13.05 |
| Core Architecture | ARM Cortex-A5 (ARMv7-A) | ARM Cortex-A5 (Armv7-A) |
| Maximum CPU Clock | 500 MHz | — |
| Core Count | 1 | — |
| Internal SRAM | 128 KB | — |
| Internal ROM | 160 KB (secure boot) | — |
| External Memory Interface | 16-bit DDR2/LPDDR/LPDDR2/DDR3 (LV-DDR3) | — |
| Supply Voltage (Core) | 1.2 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 封装 | 256-TFBGA (8x8 mm, 0.4 mm pitch) | 289-LFBGA (14x14 mm) |
| 工作温度 | -40C to +85C (industrial) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | 3 | [DATA_NEEDED: MSL level] |
| Ethernet | 1x 10/100 Mbps GMAC | — |
| USB | USB 2.0 High-Speed Host + Device (with PHY) | — |
| LCD Controller | Yes (TFT, up to XGA) | — |
| Touch Controller | Yes (Peripheral Touch Controller + 4-wire resistive) | — |
| Hardware Crypto | AES, SHA-256, TRNG | — |
| Backup Mode Current | 5 uA typical | 5 uA |
| RoHS 状态 | Compliant | Compliant |
| Number of Cores | — | 1 |
| 最大时钟频率 | — | 500 MHz |
| L1 Instruction Cache | — | 32 kbyte |
| L1 Data Cache | — | 32 kbyte |
| L2 Cache | — | 128 kbyte (configurable as SRAM) |
| Memory Management Unit | — | Yes (MMU) |
| NEON Media Processing Engine | — | Yes |
| Arm TrustZone | — | Yes |
| ETM/ETB Support | — | Yes |
| DDR Memory Interface | — | DDR2, DDR3L, LPDDR2, LPDDR3 |
| Flash Memory Interface | — | QSPI, e.MMC |
| Security Features | — | Secure boot, AES, SHA, TRNG, tamper pins |
| Peripheral Interfaces | — | I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC |
| Embedded Audio Subsystem | — | Yes |
| Ball Pitch | — | 0.8 mm |
| 工作温度范围 | — | -40C to +85C (industrial, -CN grade) |