ATSAMA5D26B-CNR vs ATSAMA5D26B-CN 对比
详细并排对比 ATSAMA5D26B-CNR 出自 Microchip Technology 和 ATSAMA5D26B-CN 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
ATSAMA5D26B-CNR ✓ 量产中Microchip Technology
ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA
ATSAMA5D26B-CN ✓ 量产中规格对比
| 参数 | ATSAMA5D26B-CNR | ATSAMA5D26B-CN |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.10 | $13.05 |
| Core Architecture | Arm Cortex-A5 (Armv7-A) with NEON and FPU | ARM Cortex-A5 (Armv7-A) |
| Maximum Core Frequency | 500 MHz | — |
| Core Count | 1 | — |
| Internal SRAM | 128 KB | — |
| External Memory Support | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND | — |
| 封装 | 289-LFBGA (14x14x1.4 mm) | 289-LFBGA (14x14 mm) |
| Ball Pitch | 0.8 mm | 0.8 mm |
| Graphics Controller | 2D LCD controller, up to 2048x2048 | — |
| Ethernet | 2x EMAC with IEEE 1588 (10/100 Mbps) | — |
| USB | USB 2.0 High-Speed Host and Device | — |
| Serial Interfaces | 6x FLEXCOM (USART/SPI/TWI), 2x CAN-FD | — |
| Audio | Embedded audio subsystem (SSC, I2S) | — |
| Security | Crypto accelerator, secure boot, tamper detection, TRNG | — |
| 工作温度 | -40C to +85C (Industrial) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | 3 | [DATA_NEEDED: MSL level] |
| RoHS 状态 | Compliant | Compliant |
| Number of Cores | — | 1 |
| 最大时钟频率 | — | 500 MHz |
| L1 Instruction Cache | — | 32 kbyte |
| L1 Data Cache | — | 32 kbyte |
| L2 Cache | — | 128 kbyte (configurable as SRAM) |
| Memory Management Unit | — | Yes (MMU) |
| NEON Media Processing Engine | — | Yes |
| Arm TrustZone | — | Yes |
| ETM/ETB Support | — | Yes |
| DDR Memory Interface | — | DDR2, DDR3L, LPDDR2, LPDDR3 |
| Flash Memory Interface | — | QSPI, e.MMC |
| Backup Mode Current | — | 5 uA |
| Security Features | — | Secure boot, AES, SHA, TRNG, tamper pins |
| Peripheral Interfaces | — | I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC |
| Embedded Audio Subsystem | — | Yes |
| 工作温度范围 | — | -40C to +85C (industrial, -CN grade) |