EP1SGX10DF672C7N vs EP1SGX10DF672I6N 对比

详细并排对比 EP1SGX10DF672C7N 出自 Intel 和 EP1SGX10DF672I6N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1SGX10DF672I6N EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N ⚠ 最后一次采购

规格对比

参数 EP1SGX10DF672C7N EP1SGX10DF672I6N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $0.00 $85.20
Product Type Field Programmable Gate Array (FPGA) —
Device Family Stratix GX —
Logic Cells 10,570 cells 10,570
User I/O 362 I/O —
Logic Family CMOS CMOS
Process Technology 130 nm —
电源电压 1.5 V —
封装 672-Ball FC-FBGA —
Alternative Package Description FBGA-1020 —
Package Body 33 mm x 33 mm —
Ball Pitch 1 mm —
Listed Frequency Figure 4,385.97 MHz —
工作温度 0 C to 85 C 0 C to 85 C (Industrial, "I" grade)
安装类型 Surface Mount Surface Mount
DigiKey Product Category FPGAs (Field Programmable Gate Array) —
RoHS 状态 unknown Compliant
REACH Status unknown —
AEC-Q100 Status not_applicable —
Series — Stratix GX
Family — Stratix GX (EP1SGX)
Logic Elements — 10,570
CLBs (Logic Array Blocks) — 1,200 LABs / 1200 CLBs
Total RAM Bits — 920,448 bits
User I/O Pins — 362
Package Type — FBGA-672 (FineLine BGA)
Package Code — BGA, 672 balls
Package Dimensions — 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch
Core Supply Voltage — 1.5 V (1.425 V to 1.575 V)
Lead Free Status — Lead Free (FBGA-672, per Ampheo listing)

数据手册与资源

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