EP20K200CB356C7ES vs EP20K200CB356C8ES 对比
详细并排对比 EP20K200CB356C7ES 出自 Intel 和 EP20K200CB356C8ES 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP20K200CB356C7ES | EP20K200CB356C8ES |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $108.50 | $178.00 |
| Family | APEX 20KC | APEX 20KC MultiCore Interconnect FPGA |
| System Gates | 200,000 | 200,000 |
| Logic Elements / Cells | 8,320 | 8,320 |
| Maximum User I/O | 271 | — |
| 封装 | 356-Ball BGA (CB) | — |
| Core Voltage | 1.8 V | 1.8 V |
| Operating Frequency (max) | 375.94 MHz | 301.21 MHz |
| Process Technology | 0.15 µm CMOS | 0.15 µm |
| Embedded Memory Blocks | Yes (ESB - True Dual-Port / CAM) | — |
| PLLs | 4 | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0°C to +70°C) | — |
| RoHS 状态 | [DATA_NEEDED: rohs status] | [DATA_NEEDED: rohs status] |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Series | — | APEX 20KC |
| User I/O Count | — | 271 |
| Package Type | — | 356-LBGA (Ball Grid Array) |
| 工作温度 | — | 0°C to +85°C (Commercial) |
| Speed Grade | — | C8 (8 ns) |
| 存储器类型 | — | SRAM-based, Embedded System Blocks (ESBs) |
| Programming Interface | — | JTAG / ByteBlaster / USB-Blaster |
| Design Software | — | Quartus II / MAX+PLUS II |
| Embedded Memory | — | Yes (ESBs) |