EP2A25F672I6 vs EP2A25F672C9N 对比

详细并排对比 EP2A25F672I6 出自 Intel 和 EP2A25F672C9N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2A25F672I6 EP2A25F672C9N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $178.00 $195.00
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 µm all-layer copper, up to 8 metal layers
封装 672-ball FineLine BGA (FBGA-672) 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 —
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM Enhanced System Blocks (ESBs) for dual-port RAM
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS 状态 [DATA_NEEDED: RoHS compliance status] Compliant (per distributor listings)
Lead-Free [DATA_NEEDED: lead-free status] —
MSL 等级 [DATA_NEEDED: moisture sensitivity level] —
安装类型 Surface Mount (BGA) Surface Mount (BGA)
Logic Elements / Cells — 24320
System Gates — Approx. 900000
Maximum User I/O — 492
Operating Frequency — 236 MHz
Core Supply Voltage (VCCINT) — 1.425 V to 1.575 V (nominal 1.5 V)
Seated Height (max) — 2.100 mm
Propagation Delay — 2.23 ns
Logic Family — CMOS
工作温度 — 0 °C to +85 °C (commercial, C9 grade)
I/O Standards Supported — LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport
LVDS Data Rate — Up to 1 Gbps (True-LVDS)
Configuration Interface — Serial / Parallel PROM, JTAG, passive parallel (enhanced)
Design Software — Quartus II (v5.1 or later)

数据手册与资源

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