EP2A25F672I6 vs EP2A25F672I-9 对比
详细并排对比 EP2A25F672I6 出自 Intel 和 EP2A25F672I-9 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2A25F672I6 | EP2A25F672I-9 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $178.00 | $195.00 |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS |
| 封装 | 672-ball FineLine BGA (FBGA-672) | 672-pin FCBGA (FineLine BGA) |
| Core Voltage | 1.5 V | 1.5 V / 1.8 V (speed-grade dependent) |
| Configuration Method | External SRAM configuration device (EPC series) | JTAG / serial configuration EPROM |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | -9 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | — |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (typical) | — | 25,000 |
| Maximum System Gates | — | [DATA_NEEDED: maximum system gates] |
| Embedded System Blocks (ESB) Memory | — | 1,125 Kbits |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O pins] |
| Number of PLLs | — | 4 |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C junction) |
| 湿敏等级（MSL） | — | 3 (per Vyrian listing) |
| Peak Reflow Temperature | — | 220 °C (per Vyrian listing) |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, PCI |
| Legacy Status | — | Obsolete - consult Altera / Intel FPGA archive for documentation |