EP2AGX125EF29I3G vs EP2AGX125DF25I3G 对比

详细并排对比 EP2AGX125EF29I3G 出自 Intel 和 EP2AGX125DF25I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2AGX125EF29I3G EP2AGX125EF29I3G Arria II GX FPGA | Intel

EP2AGX125EF29I3G Arria II GX FPGA | Intel

EP2AGX125EF29I3G ✓ 量产中
Intel
EP2AGX125DF25I3G EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G ⚠ 最后一次采购

规格对比

参数 EP2AGX125EF29I3G EP2AGX125DF25I3G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $590.96 $895.00
Device Type Field Programmable Gate Array (FPGA) —
Product Family Arria II GX —
Programmable Logic 118143 logic elements —
Programmable Bits 8315904 bits —
User I/O 372 I/O —
Package Type 780-BBGA, FCBGA —
Package Code HBGA —
Terminal Count 780 terminals —
Terminal Form Ball —
Package Shape Square —
电源电压 0.9 V 0.9 V core
Temperature Grade Industrial —
安装类型 Surface Mount Surface Mount
Configuration Technology FPGA programmable logic —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
Series — Arria II GX
Logic Elements — 118,143
Embedded Memory — 8,315,904 bits
Number of I/O — 260
封装 — 572-BGA, FCBGA (Flip-Chip FineLine BGA)
Core Voltage — 0.9 V
Process Technology — 40 nm
Maximum Operating Frequency — 500 MHz
Transceivers — Up to 12 (3.75 Gbps per channel)
工作温度 — -40C to +100C (Industrial)
DSP Blocks — 18x18 multipliers
MSL 等级 — [DATA_NEEDED: MSL Level]

数据手册与资源

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