EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel
料号： EP2AGX125EF35C4G ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1420 | $710,000.00 |
| 1,000 | $1290 | $1,290,000.00 |
EP2AGX125EF35C4G 概述
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, interconnect, and I/O can be configured by the customer after manufacture. FPGAs sit within the broader hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Arria II GX family occupies the mid-density, transceiver-rich tier between Cyclone (low-cost) and Stratix (high-performance) families, offering a balance of cost, power, and high-speed serial capability.
Key features include 12 transceiver channels with integrated Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA), up to 6.375 Gbps data rate per channel, hard PCI Express Gen1/Gen2 IP cores with x1/x4/x8 endpoint and rootport support, and dedicated DSP blocks with up to 552 18x18 multipliers. Memory interfaces support DDR3, DDR2, and QDR II/II+ SRAM at rates up to 800 Mbps. The 40nm process technology delivers static power reductions of up to 50% versus prior-generation 65nm FPGAs.
Architecturally, the Arria II GX employs a logic array based on 8-input adaptive look-up tables (ALUTs), embedded memory (M9K and M144K blocks), and variable-precision DSP blocks. Transceivers integrate signal-conditioning features including pre-emphasis, equalization, and output swing control. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using industry-standard SRAM-based configuration bits.
Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, Gbps Ethernet), wireless baseband processing, video broadcast and image processing, military radar signal processing, and test and measurement equipment. The combination of transceivers and DSP blocks makes it well suited for protocol bridging and high-throughput data acquisition.
When designing with this device, allocate adequate power-decoupling capacitance (typically 200-300 uF bulk plus per-pin decoupling) and follow Intel's recommended PCB layout for the FC-FBGA package. The transceiver reference clocks require clean jitter performance; use a dedicated low-jitter oscillator and matched-length routing to the CLK pins.
This page synthesizes distributor pricing, package-specific drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP2AGX125EF35C4G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX125EF35C4G （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Transceivers, Operating Temperature, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP2AGX125EF35C4N
✅ 直接替换📋 参考替代料（不在目录中）
EP2AGX125EF35C5G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP2AGX125EF35C6G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP2AGX125EF35I5G
✅ 直接替换✓ 有现货
$1190 / 个
查看数据手册 →EP2AGX125EF35C4G 最大额定值与电气特性
| Family | Arria II GX |
| Logic Elements | 118,143 |
| Embedded Memory Bits | 8,315,904 |
| Hardware Multipliers (18x18) | 452 |
| Transceiver Channels | 12 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| 封装 | 1152-ball FC-FBGA (Flip-Chip) |
| 工作温度 | 0C to +85C (Commercial) |
| 安装类型 | Surface Mount |
| Configuration Method | SRAM-based, PS/FPP/JTAG |
| RoHS 状态 | Compliant |
| Speed Grade | C4 |
| Lead-Free | Yes |
EP2AGX125EF35C4G 1152-ball fc-fbga (flip-chip) 引脚配置指南
EP2AGX125EF35C4G（1152-ball fc-fbga (flip-chip) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX125EF35C4G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX125EF35C4G 适用于 6 应用s: PCI Express Endpoint Cards, Wireless Baseband Processing, Video Broadcast and Image Processing, Test and Measurement Equipment, Serial RapidIO and Gbps Ethernet Switching, Military and Aerospace Signal Processing.
PCI Express Endpoint Cards
The EP2AGX125EF35C4G's hard PCI Express Gen1/Gen2 IP core with x1/x4/x8 support makes it well suited for PCIe endpoint card designs in data acquisition, instrumentation, and embedded computing. The integrated transceiver channels deliver up to 6.375 Gbps raw serial rate, which is more than sufficient for PCIe Gen2 (5 Gbps) with margin for protocol overhead. Engineers typically implement the PCIe hard IP block to offload transaction layer and data link layer functions, freeing the FPGA fabric for application logic. The 118K logic elements and 8.3 Mbit embedded memory provide ample resources for DMA engines, protocol bridging, and user-defined register sets. Combined with the 452 DSP blocks, complex signal preprocessing can be performed on the card before DMA transfer to host memory.
推荐
Wireless Baseband Processing
Wireless baseband signal processing benefits from the EP2AGX125EF35C4G's combination of 452 18x18 multipliers, 8.3 Mbit embedded memory, and CPRI/OBSAI-compliant transceivers at up to 6.375 Gbps. The DSP blocks deliver up to 76 GMACs of fixed-point performance at 250 MHz, sufficient for LTE and WiMAX PHY layer processing including FFT/iFFT, channel estimation, and MIMO decoding. The transceivers support CPRI rates up to 4.9152 Gbps for direct connection to RF front-end modules. Tight coupling between DSP blocks and M9K/M144K memory blocks enables efficient implementation of dual-buffer architectures for pipelined signal processing, reducing external memory bandwidth requirements.
推荐
Video Broadcast and Image Processing
Broadcast video applications including SDI/HD-SDI/3G-SDI conversion, video format translation, and real-time image processing pipelines are well served by the EP2AGX125EF35C4G. The 12 transceiver channels at up to 6.375 Gbps support multiple SDI streams simultaneously, with each SDI link fitting comfortably within 2.97 Gbps for 3G-SDI. The DSP blocks enable real-time colour space conversion, scaling, and overlay composition. The 8.3 Mbit embedded memory provides line buffers and frame buffering for multi-stream processing, while the 118K logic elements accommodate complex video processing IP cores. Hard memory controllers support DDR3 interfaces for off-chip frame buffer storage in larger broadcast routers and switchers.
推荐
Test and Measurement Equipment
High-end test and measurement instruments including oscilloscopes, logic analysers, and protocol analysers leverage the EP2AGX125EF35C4G's combination of high-speed transceivers, DSP performance, and abundant logic resources. The transceivers support multi-gigabit serial data acquisition and pattern generation, with the PCS blocks handling 8b/10b encoding/decoding and word alignment. The 452 DSP blocks enable real-time signal processing including FFT, digital down-conversion, and waveform synthesis. The integrated hard PCIe IP allows high-throughput data transfer to host processors for further analysis. The device's deterministic timing and low-latency transceiver switching are critical for protocol-aware test equipment.
推荐
Serial RapidIO and Gbps Ethernet Switching
The EP2AGX125EF35C4G supports Serial RapidIO (SRIO) and multi-gigabit Ethernet implementations through its 12 transceiver channels at up to 6.375 Gbps. Serial RapidIO at 3.125 Gbps (1x lane) or 6.25 Gbps (4x lane aggregated) fits well within the device's capability, supporting embedded computing backplanes in military and telecom systems. Gigabit Ethernet implementations benefit from the integrated transceivers with embedded PCS blocks supporting 10/100/1000 Mbps and 10 Gbps Ethernet MAC implementations in FPGA fabric. The hardware PCIe hard IP enables co-existence of PCIe and SRIO links on the same device, useful for heterogeneous switching fabric designs.
推荐
Military and Aerospace Signal Processing
Military and aerospace applications including radar signal processing, electronic warfare systems, and secure communications benefit from the EP2AGX125EF35C4G's combination of high DSP throughput and high-speed serial interfaces. The 452 18x18 multipliers support pulse compression, MTI filtering, and beamforming algorithms required in phased-array radar implementations. The transceivers support data links to ADCs/DACs in radar front-ends and to other processing nodes in distributed systems. For military-grade operation, the EP2AGX125EF35I5G industrial variant qualified to -40C to +100C operating range provides extended environmental tolerance while maintaining drop-in compatibility with the commercial version on the same FC-FBGA-1152 footprint.
推荐
推荐产品汇总
工程参考数据： EP2AGX125EF35C4G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX125EF35C4N | EP2AGX125EF35C5G | EP2AGX125EF35C6G | EP2AGX125EF35I5G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35mm) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 |
| Speed Grade | C4 | C4 | C5 (slower) | C6 (slowest) | I5 (industrial) |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) |
| RoHS Compliance | Yes (G suffix) | No (N suffix) | Yes | Yes | Yes |
| Transceiver Channels | 12 | 12 | 12 | 12 | 12 |
| Max Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Embedded Memory | 8,315,904 bits | 8,315,904 bits | 8,315,904 bits | 8,315,904 bits | 8,315,904 bits |
| Hardware Multipliers (18x18) | 452 | 452 | 452 | 452 | 452 |
关键差异点
- RoHS-compliant lead-free termination for global market access （对比 EP2AGX125EF35C4N)
- Mid-tier speed grade balancing performance and yield （对比 EP2AGX125EF35C6G)
- Commercial temperature grade optimised for cost-sensitive deployments （对比 EP2AGX125EF35I5G)
设计说明
The 1152-ball FC-FBGA package requires a thermal management strategy. Estimated: at typical utilisation of 50% logic elements and full 6.375 Gbps transceiver activity, the device dissipates approximately 8-12 W. The FC-FBGA substrate exposes the die directly to a heat spreader; use a thermal interface material (TIM) and attach a heatsink with sufficient airflow. For designs exceeding 10 W, consider the industrial-grade variant EP2AGX125EF35I5G for higher junction temperature margin.
The FC-FBGA-1152 package uses 1.0 mm ball pitch with the 35 mm x 35 mm body. PCB design requires high-density interconnect (HDI) with microvia stack-up, typically 6-8 layer boards with mixed dielectric materials. All transceiver channel pairs must use controlled impedance (100 ohm differential) routing with length matching to within 5 mils. Intel provides reference PCB stackup guidance in the Arria II GX handbook; failure to follow these guidelines can cause transceiver signal integrity failures.
The EP2AGX125EF35C4G requires multiple voltage rails: 0.9 V core, 1.0 V PLL analog, 1.5 V transceiver analog, and 2.5 V/3.0 V I/O depending on bank configuration. Power sequencing must follow Intel's specified order to prevent latch-up; typically core voltages ramp first, then transceiver analog, then I/O. Use the dedicated Enpirion power management ICs recommended by Intel or equivalent with proper sequencing. Bulk decoupling of 200-300 uF per rail plus per-pin ceramic decoupling is required.
Transceiver reference clock routing is critical for jitter performance. Use a dedicated low-jitter oscillator (less than 1 ps RMS jitter) and route the differential clock pair with 100 ohm controlled impedance and length matching. Isolate the clock traces from switching signals and use guard traces or stripline routing. The transceiver reference clocks feed PLLs that multiply up to serial data rates, so any added jitter directly degrades link margin.
Common design pitfalls with the EP2AGX125EF35C4G include: (1) exceeding 6.375 Gbps with the C4 speed grade will fail timing closure - check fMAX for your specific transceiver configuration; (2) configuration bitstream size for the full 118K-LE device is approximately 29 Mbit, requiring appropriate EPCQ flash sizing; (3) JTAG chain conflicts when multiple devices share the bus - use TCK pull-down resistors; (4) Last Time Buy status means long-term production planning should consider migration to Arria V GX or Arria 10.
合规信息
RoHS compliant per 'G' suffix designation in the MPN. Lead-free per RoHS directive. Halogen-free status not explicitly stated in distributor data. Not AEC-Q100 qualified (FPGAs are not typically AEC-Q100 qualified at the component level).
