EP2AGX45CU17I3G vs EP2AGX45DF25I3G 对比
详细并排对比 EP2AGX45CU17I3G 出自 Intel 和 EP2AGX45DF25I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGX45CU17I3G | EP2AGX45DF25I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $445.00 | $370.00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| 工作温度 | -40C to +100C (Industrial) | — |
| 封装 | 358-ball UBGA (FCBGA), 17x17 mm | 572-ball FCBGA (HBGA) |
| Ball Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等级 | 3 (168 hours) | 3 |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements (LE) | — | 42,959 |
| Adaptive Logic Modules (ALM) | — | 17,715 |
| Embedded Memory Bits | — | 3,517,440 bits |
| Embedded Memory M9K Blocks | — | [DATA_NEEDED: M9K block count] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Maximum User I/O Pins | — | 252 |
| Transceiver Channels | — | [DATA_NEEDED: MGT channel count] |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Package Dimensions | — | 25 mm x 25 mm |
| 工作温度范围 | — | -40C to +100C (Industrial) |
| Speed Grade | — | I3 |
| Process Node | — | 40 nm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT] |
| Hard IP for PCIe | — | PCIe Gen1/Gen2 endpoints and root ports |
| Lead-Free | — | Yes |