EP2SGX60DF780C3 vs EP2SGX60DF780C5N 对比

详细并排对比 EP2SGX60DF780C3 出自 Intel 和 EP2SGX60DF780C5N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2SGX60DF780C3 EP2SGX60DF780C5N
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $218.00 $205.00
Family Stratix II GX Stratix II GX
Series Stratix II —
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 —
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 12
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz 609.76 MHz
封装 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch —
安装类型 Surface Mount Surface Mount (BGA)
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) 5 (lower speed, higher Fmax margin)
RoHS 状态 Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) [DATA_NEEDED: confirm RoHS compliance from manufacturer product page]
Logic Elements — 60,440
Number of LABs/CLBs — 3,022
Embedded Memory (bits) — 2,544,192 (≈2.5 Mb)
User I/O Count — 364
Max Transceiver Data Rate — 6.375 Gbps
Core Supply Voltage — 1.2 V
Package Type — 780-pin Flip-Chip BGA (FBGA-780)
Operating Temperature Grade — Commercial
Design Software — Quartus II

数据手册与资源

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