EP2SGX60DF780C3 vs EP2SGX60DF780C5N Vergleich

Detaillierter Direktvergleich von EP2SGX60DF780C3 von Intel und EP2SGX60DF780C5N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60DF780C3 EP2SGX60DF780C5N
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $218,00 $205,00
Family Stratix II GX Stratix II GX
Series Stratix II —
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 —
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 12
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz 609.76 MHz
Gehäuse 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch —
Montageart Surface Mount Surface Mount (BGA)
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) 5 (lower speed, higher Fmax margin)
RoHS-Status Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) [DATA_NEEDED: confirm RoHS compliance from manufacturer product page]
Logic Elements — 60,440
Number of LABs/CLBs — 3,022
Embedded Memory (bits) — 2,544,192 (≈2.5 Mb)
User I/O Count — 364
Max Transceiver Data Rate — 6.375 Gbps
Core Supply Voltage — 1.2 V
Package Type — 780-pin Flip-Chip BGA (FBGA-780)
Operating Temperature Grade — Commercial
Design Software — Quartus II

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