EP2SGX60EF1152C4 vs EP2SGX60EF1152C5N 对比

详细并排对比 EP2SGX60EF1152C4 出自 Intel 和 EP2SGX60EF1152C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX60EF1152C4 EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 ⚠ 最后一次采购
Intel
EP2SGX60EF1152C5N EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C5N ⚠ 最后一次采购

规格对比

参数 EP2SGX60EF1152C4 EP2SGX60EF1152C5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $1,067.86 $3,300.00
Device Family Stratix II GX —
Logic Elements (LE) 60,440 60,440
Logic Array Blocks / CLBs 3022 —
Total RAM Bits 2,544,192 —
User I/O Pins 534 —
Number of LABs/CLBs 3022 —
Package Type 1152-BBGA, FC-FBGA —
Package Pitch 1.0 mm —
Core Voltage 1.15 V to 1.25 V 1.2 V
Internal Frequency 717 MHz (max) —
Propagation Delay [DATA_NEEDED: propagation delay exact value] —
Process Technology 90 nm CMOS 90 nm CMOS
Speed Grade C4 (commercial) -5 (mid)
工作温度 0C to 85C (commercial) Commercial (0C to +85C)
安装类型 Surface Mount Surface Mount (Flip-Chip BGA)
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes [DATA_NEEDED: lead-free status]
Family — Stratix II GX
Logic Array Blocks (LABs) — 3022
Embedded Memory Bits — 2,544,192
User I/O Count — 534
Maximum Operating Frequency — 609.76 MHz
封装 — 1152-ball FC-FBGA
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

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