EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
料号： EP2SGX60EF1152C4 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1668.53 | $1,668.53 |
| 10 | $1501.68 | $15,016.80 |
| 100 | $1334.83 | $133,483.00 |
| 250 | $1201.34 | $300,335.00 |
| 500 | $1067.86 | $533,930.00 |
EP2SGX60EF1152C4 概述
A Field Programmable Gate Array is a programmable logic device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory blocks. Within the broader programmable-logic taxonomy, an FPGA sits between a CPLD (smaller, non-volatile, deterministic timing) and an ASIC (mask-programmed, highest density, lowest unit cost). The Stratix II GX family is engineered for high-speed serial I/O and DSP-intensive applications such as wireline communications, broadcast video, and military signal processing.
Key features include 3022 LABs/CLBs, 24 (7+11) embedded 18-bit x 18-bit multipliers, embedded TriMatrix memory blocks distributed throughout the fabric, and 12 full-duplex multi-gigabit transceivers (MGTs) that natively support PCI Express, Serial RapidIO, XAUI, and CPRI protocols. The 1152-pin FC-FBGA package (35 mm x 35 mm body, 1.0 mm pitch) supports high I/O count and high transceiver ball-out. The part is lead-free (Pb-free) and RoHS compliant per the manufacturer product page.
Typical applications include 10 Gbps wireline interfaces, software-defined radio baseband processing, ASIC prototyping, high-speed data acquisition, and PCI Express Gen1 endpoint cards. The combination of abundant logic, large on-chip memory, and multi-gigabit transceivers makes the device well suited for systems that require parallel DSP and serial connectivity on the same die. The "C4" speed grade is approximately 7%-10% slower than the fastest "C5" / "C6" grades but offers lower cost for designs that do not require the highest fmax.
When designing with this device, plan power sequencing carefully: the 1.2 V core, 2.5 V/3.3 V auxiliary, and 1.2 V/1.5 V transceiver supplies must ramp in a defined order to avoid latch-up. Use at least eight PCB layers with continuous ground and power planes, and follow the Altera Stratix II GX Handbook decoupling recommendations for the 1152-FBGA package.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II GX family, and practical design notes that are not duplicated on the manufacturer datasheet.
直接替换替代料： EP2SGX60EF1152C4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2SGX60EF1152C4 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Mounting Type, Core Voltage.
快速对比工具——选择替代料号进行并排对比：
EP2SGX60EF1152C4N
✅ 直接替换✓ 有现货
$1350 / 个
查看数据手册 →EP2SGX60EF1152C5
✅ 直接替换✓ 有现货
$1380 / 个
查看数据手册 →EP2SGX60EF1152C3
✅ 直接替换✓ 有现货
$2210 / 个
查看数据手册 →EP2SGX60EF1152C3N
✅ 直接替换✓ 有现货
$2195 / 个
查看数据手册 →EP2SGX90EF1152C4
✅ 直接替换✓ 有现货
$890 / 个
查看数据手册 →EP2SGX60EF1152C4 最大额定值与电气特性
| Device Family | Stratix II GX |
| Logic Elements (LE) | 60,440 |
| Logic Array Blocks / CLBs | 3022 |
| Total RAM Bits | 2,544,192 |
| User I/O Pins | 534 |
| Number of LABs/CLBs | 3022 |
| Package Type | 1152-BBGA, FC-FBGA |
| Package Pitch | 1.0 mm |
| Core Voltage | 1.15 V to 1.25 V |
| Internal Frequency | 717 MHz (max) |
| Process Technology | 90 nm CMOS |
| Speed Grade | C4 (commercial) |
| 工作温度 | 0C to 85C (commercial) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
EP2SGX60EF1152C4 1.0 mm 引脚配置指南
EP2SGX60EF1152C4（1.0 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2SGX60EF1152C4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2SGX60EF1152C4 适用于 6 应用s: 10 Gbps Wireline Communication Interfaces, Software-Defined Radio Baseband Processing, PCI Express Endpoint Card, High-Speed Data Acquisition Systems, ASIC Prototyping and Emulation, Broadcast Video Processing and Routing.
10 Gbps Wireline Communication Interfaces
The EP2SGX60EF1152C4 fits 10 Gbps wireline interfaces because its 12 multi-gigabit transceivers operate up to 6.375 Gbps per channel natively, with hard PCS blocks for 8b/10b encoding and clock-data recovery. Two transceivers can be bonded for XAUI or aggregated via soft logic for 10G KR, while the 60K LE fabric absorbs the MAC, PCS glue, and any protocol-specific shimming. Typical designs place this part between an optical module and a network processor, replacing legacy ASIC + FPGA partitions. Designers should budget at least 4 PCB layers dedicated to transceiver channel routing with impedance-controlled differential pairs.
推荐
Software-Defined Radio Baseband Processing
For software-defined radio (SDR) baseband processing, the EP2SGX60EF1152C4 delivers 60,440 logic elements plus 192 embedded 18-bit x 18-bit multipliers (DSP blocks), enabling multi-channel LTE, WiMAX, or military waveform implementation on a single die. The 2.5 Mbit of TriMatrix on-chip RAM acts as a fast sample buffer between the ADC interface and the FFT/filters, reducing the need for external SRAM. The transceivers digitize IF or RF outputs directly into the FPGA at rates up to 6.375 Gbps. SDR designers should plan for 1.2 V core current near 5-6 A under heavy DSP load and use a multi-phase buck regulator.
推荐
PCI Express Endpoint Card
The EP2SGX60EF1152C4 is a strong match for PCI Express Gen1 endpoint cards because its hard IP supports x1, x4, and x8 lane configurations with no soft-logic overhead for the PCS layer. The device exposes 8 dedicated PCIe lanes through the multi-gigabit transceiver block, with the remaining transceivers available for auxiliary interfaces such as SATA or SGMII to a network phy. The 534 user I/O pins allow wide local-bus expansion to DDR2/DDR3 memories and high-speed companion chips. Compliance with PCI Express CEM requires careful reference-clock routing, so PCB designers should consult the Altera PCIe user guide.
推荐
High-Speed Data Acquisition Systems
The EP2SGX60EF1152C4 fits high-speed data acquisition because its 12 transceivers accept serial ADC data at multi-gigabit rates, while the 2.5 Mbit of on-chip RAM aggregates samples before DMA to the host. The 717 MHz internal fmax supports real-time FIR/FFT processing at full sample rate, eliminating the latency of off-chip DSP. In oscilloscope or radar digitizer designs the FPGA typically drives a DDR2/DDR3 memory controller and a PCIe Gen2 x8 uplink. The 1152-FBGA package exposes enough I/O to fan out to multiple front-end ADC/DAC channels simultaneously.
推荐
ASIC Prototyping and Emulation
For ASIC prototyping and emulation, the EP2SGX60EF1152C4 offers 60K LE plus multi-gigabit transceivers, allowing verification of up to 5-7 million ASIC gates per device with multiple FPGAs stacked. The large embedded RAM mirrors ASIC SRAM blocks closely, improving correlation between prototype and silicon. The transceivers model high-speed SerDes interfaces that are common in modern ASIC designs. Engineers partition ASIC RTL across multiple Stratix II GX FPGAs using a multi-FPGA partitioner such as Certify or Synopsys Certify, then validate at near-real-time speeds.
推荐
Broadcast Video Processing and Routing
In broadcast video processing the EP2SGX60EF1152C4 supports SDI, HD-SDI, and 3G-SDI standards through dedicated soft IP cores running on the high-speed transceivers, while the logic fabric handles de-embedding, color-space conversion, and frame-rate conversion in real time. The 534 I/O pins let multiple video streams flow in parallel without external crosspoint chips. Designers benefit from the large block-RAM for line-store buffers and the abundant multipliers for chroma/luma filtering. The commercial temperature range suits studio equipment; for outside-broadcast trucks choose the industrial-grade EP2SGX60EF1152I4 variant.
推荐
推荐产品汇总
工程参考数据： EP2SGX60EF1152C4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2SGX60EF1152C4N | EP2SGX60EF1152C5 | EP2SGX60EF1152C3 | EP2SGX60EF1152C3N | EP2SGX90EF1152C4 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FCBGA | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same |
| Logic Elements | 60,440 | 60,440 (identical) | 60,440 (identical) | 60,440 (identical) | 60,440 (identical) | 90,720 (+50%) |
| Speed Grade | C4 | C4 (identical) | C5 (faster) | C3 (slower) | C3 (slower) | C4 (same) |
| Total RAM Bits | 2,544,192 | 2,544,192 (identical) | 2,544,192 (identical) | 2,544,192 (identical) | 2,544,192 (identical) | 4,415,040 (+74%) |
| User I/O Pins | 534 | 534 (identical) | 534 (identical) | 534 (identical) | 534 (identical) | 534 (identical) |
| Process / Core Voltage | 90 nm / 1.15-1.25 V | 90 nm / 1.15-1.25 V (identical) | 90 nm / 1.15-1.25 V (identical) | 90 nm / 1.15-1.25 V (identical) | 90 nm / 1.15-1.25 V (identical) | 90 nm / 1.15-1.25 V (identical) |
| Lifecycle Status | Last-time-buy / NRND | Last-time-buy / NRND | Last-time-buy / NRND | Last-time-buy / NRND | Last-time-buy / NRND | Last-time-buy / NRND |
关键差异点
- Lead-free vs leaded solder balls in the same footprint （对比 EP2SGX60EF1152C4N)
- Higher internal fmax for tighter timing closure （对比 EP2SGX60EF1152C5)
- Up to 50% more logic capacity in the same package （对比 EP2SGX90EF1152C4)
设计说明
Power sequencing is mandatory on the EP2SGX60EF1152C4 because of the mixed-voltage domains: VCCINT (1.2 V core), VCCAUX (2.5 V), VCCPD (3.3 V), and the per-bank VCCIO must ramp in the order documented in the Stratix II GX Handbook (typically VCCINT first, then VCCAUX, then VCCIO). Use a multi-rail power manager such as the LTC3566 or LM3880 to enforce monotonic ramps; reversing the order can latch-up the input ESD structures. Plan at least 5 A on the 1.2 V core rail for typical designs; worst-case DSP-heavy loads can pull 7-8 A on the larger 90K LE device, so size the buck regulator with margin.
Estimated: at 1.2 V core, ~5 A typical load, and full transceiver activity, the EP2SGX60EF1152C4 dissipates approximately 6 W (P = V x I). The 1152-FBGA package has a theta-JA of roughly 8-12 C/W with a properly designed thermal via array under the central ground balls; the junction temperature must remain below 100C for the commercial temperature grade. Use at least 6 thermal vias per ground ball in a 1-2-1 stack-up, and bond the central BGA thermal pad directly to an inner ground plane for best heat spreading. Avoid placing the FPGA on the underside of the board where heat removal is constrained.
The 1152-FBGA at 1.0 mm pitch requires high-density interconnect (HDI) PCB fabrication: use laser-drilled micro-vias (4-mil pad, 8-mil drill) for the top signal layers and conventional plated through-holes for inner power/ground and outer layers. Maintain 100-ohm differential impedance on all transceiver channels and 50-ohm single-ended on the global clocks. Reference the Altera Stratix II GX PCB Design Guidelines for via-in-pad recommendations, length-matching tolerances (typically +/- 5 mil for PCIe x8 lanes), and the keep-out zones around the transceiver reference-clock pins.
Common pitfalls on EP2SGX60EF1152C4 designs include: (1) using older Quartus II versions (pre-9.0) that lack support for the silicon revision, (2) leaving the MSEL configuration pins floating, which selects an unintended configuration mode and brick the device, (3) forgetting the external pull-up on nCONFIG and the pull-down on nSTATUS per the configuration handbook, and (4) selecting a non-1.0 mm-pitch BGA footprint from a generic library. Verify all four are correct before board bring-up to avoid unnecessary rework.
合规信息
Standard C4 variant has leaded solder balls; use the 'N' suffix variant (EP2SGX60EF1152C4N) for RoHS lead-free requirements. Industrial temperature variants use the 'I' suffix. AEC-Q100 is not applicable - this is a high-end FPGA, not an automotive-grade part.
