EP2SGX60EF1152I3N vs EP2SGX60EFI1152 对比
详细并排对比 EP2SGX60EF1152I3N 出自 Intel 和 EP2SGX60EFI1152 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60EF1152I3N | EP2SGX60EFI1152 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,195.00 | $0.00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| RoHS 状态 | Compliant | unknown |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Configuration Type | — | Enhanced Configuration (EPC) device |
| Logic Elements | — | 60,440 |
| Configuration-related Memory | — | 2,544,192 bits |
| User I/O | — | 534 |
| LAB Count | — | 3,022 LABs |
| 封装 | — | 1,152-ball FineLine BGA |
| 工作温度 | — | [DATA_NEEDED: operating temperature range] |
| Speed Grade | — | [DATA_NEEDED: speed grade] |
| 电源电压 | — | [DATA_NEEDED: supply voltage] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Lead-free Status | — | unknown |
| Halogen-free Status | — | unknown |