EP2SGX60EFI1152 - Stratix II GX FPGA | Intel
料号： EP2SGX60EFI1152 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2SGX60EFI1152 概述
An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic, routing, memory, and I/O resources whose configuration can be changed after manufacture. Within the broader hierarchy, the EP2SGX60EFI1152 is an FPGA, a programmable logic device, a digital integrated circuit, and ultimately a semiconductor component. Its programmable architecture allows one hardware platform to implement interfaces, protocol bridges, signal processing, control logic, and other digital systems while supporting design changes through configuration rather than a new mask set.
The highlighted device resources are 60,440 logic elements, 534 user I/O, and a 1,152-ball package. These values indicate a high-density device intended for designs requiring substantial parallel processing and wide external connectivity. The Enhanced Configuration designation in the supplied search results also indicates configuration-device relevance, although the exact supported configuration modes and electrical interfaces require confirmation from the full manufacturer datasheet.
The Stratix II GX family combines programmable logic with application-oriented connectivity for communications, industrial, test, and embedded systems. The 534 I/O resources can support multiple buses, memory interfaces, control paths, and communications links when implemented with suitable board-level signal integrity and power distribution. The large package provides a dense interconnection interface, but also makes escape routing, decoupling placement, thermal analysis, and solder-joint inspection important engineering tasks.
Typical applications include communications equipment, industrial automation, test and measurement hardware, video or imaging processing, embedded computing, and high-speed interface aggregation. The 60,440 logic elements make the device appropriate for logic-intensive designs, while 534 user I/O can support extensive external control and data paths. Designers should verify transceiver capability, clocking resources, configuration requirements, supported I/O standards, and package ball assignments against the authoritative datasheet before layout or production release.
A key trade-off is that the 1,152-ball package is a high-density BGA implementation rather than a small surface-mount package. Engineers should use the manufacturer’s recommended power planes, high-frequency decoupling, controlled-impedance routing, and thermal strategy. Because the supplied web excerpts do not establish all operating limits, missing values must be confirmed rather than inferred.
This page provides exact verified identification, resource and I/O values, source URLs, commercial context, application guidance, and clearly marked data gaps. It is intended to help engineers locate the datasheet and avoid treating an unverified package claim as a substitute for pinout or electrical validation.
直接替换替代料： EP2SGX60EFI1152 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2SGX60EFI1152 （相同外形与封装尺寸） ——差异在于 Package, Mounting Type, RoHS Status, Device Type, Package Type.
快速对比工具——选择替代料号进行并排对比：
EP2SGX60EF1152I5N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP2SGX60EF1152I4N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP2SGX60EF1152I3N
✅ 直接替换✓ 有现货
$1195 / 个
查看数据手册 →EP2SGX60EF1152C5N
✅ 直接替换✓ 有现货
$3300 / 个
查看数据手册 →EP2SGX60EF1152C4N
✅ 直接替换✓ 有现货
$1350 / 个
查看数据手册 →EP2SGX60EFI1152 最大额定值与电气特性
| Manufacturer | Intel |
| Product Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix II GX |
| Configuration Type | Enhanced Configuration (EPC) device |
| Logic Elements | 60,440 |
| Configuration-related Memory | 2,544,192 bits |
| User I/O | 534 |
| LAB Count | 3,022 LABs |
| 封装 | 1,152-ball FineLine BGA |
| 安装类型 | Surface Mount |
| RoHS 状态 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
| Lead-free Status | unknown |
| Halogen-free Status | unknown |
EP2SGX60EFI1152 1,152-ball fineline bga 引脚配置指南
EP2SGX60EFI1152（1,152-ball fineline bga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2SGX60EFI1152.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2SGX60EFI1152 适用于 6 应用s: Industrial Automation Controllers, Communications Equipment, Test and Measurement Hardware, Video and Imaging Processing, Embedded Computing Systems, High-Density Interface Aggregation.
Industrial Automation Controllers
EP2SGX60EFI1152 can serve as the programmable logic core of an industrial automation controller, where 60,440 logic elements provide capacity for sequencing, state machines, data handling, and multiple control algorithms. Its 534 user I/O are relevant for connecting sensors, actuators, motor-control interfaces, safety-monitoring circuits, and fieldbus bridges. The 1,152-ball FineLine BGA package supports a dense interface but requires controlled PCB escape routing and a carefully designed power distribution network. Because the supplied data does not confirm industrial temperature range, supply limits, or qualification status, those characteristics must be checked against the manufacturer datasheet and environmental documentation before field deployment.
推荐
Communications Equipment
EP2SGX60EFI1152 is relevant to communications equipment that requires parallel processing, protocol conversion, interface aggregation, or programmable data-path logic. The verified 60,440 logic elements and 534 user I/O provide substantial capacity for packet handling, framing, error checking, buffering control, and system management. The Stratix II GX family name suggests a communications-oriented architecture, but the supplied excerpts do not verify the number of transceivers, maximum serial rate, clocking resources, or supported protocols. Engineers should use the complete datasheet to confirm those resources, then apply impedance-controlled routing, clean reference clocks, and appropriate termination for the selected external interfaces.
推荐
Test and Measurement Hardware
EP2SGX60EFI1152 can be used in test and measurement equipment where programmable logic is needed for capture control, pattern generation, signal conditioning interfaces, timing management, and result processing. The 60,440 logic elements support complex instrument sequencing, while 534 user I/O can connect converters, display systems, control peripherals, and communication ports. The 1,152-ball BGA package supports a large pin count but introduces demanding requirements for signal integrity, power integrity, thermal management, and manufacturing inspection. The supplied data does not specify operating temperature, analog functions, I/O voltage standards, or performance limits, so the full device datasheet is required before selecting this FPGA for measurement accuracy or safety-critical instrumentation.
推荐
Video and Imaging Processing
EP2SGX60EFI1152 is potentially useful for video and imaging systems that need parallel pixel processing, frame buffering control, synchronization, and programmable interface adaptation. The 60,440 logic elements can support timing generation, format conversion, filtering, and control logic, while the 534 user I/O provide flexibility for connecting image sensors, memories, displays, and bridge components. The exact supported video interfaces, memory performance, clock rates, and I/O standards are not present in the supplied search data. A successful implementation therefore depends on confirming the datasheet resource limits and designing the BGA PCB with short, impedance-controlled paths for high-speed data and clock signals.
推荐
Embedded Computing Systems
EP2SGX60EFI1152 can provide programmable glue logic, interface arbitration, memory-control functions, and protocol adaptation in embedded computing systems. Its 60,440 logic elements are suitable for designs combining control logic with substantial data processing, and 534 user I/O can support processor buses, peripheral interfaces, memory paths, and diagnostic connections. The device is associated with a 1,152-ball FineLine BGA package, which can accommodate broad connectivity but requires careful layer-stack planning and thermal analysis. Exact configuration interface requirements, supported memory types, operating temperature, and power rails are not established by the supplied excerpts and should be verified before schematic design.
推荐
High-Density Interface Aggregation
EP2SGX60EFI1152 is suited to systems that aggregate many external interfaces into a controlled processing fabric. The verified 534 user I/O can connect parallel data buses, status signals, control lines, and peripheral interfaces, while 60,440 logic elements provide resources for arbitration, protocol translation, buffering, and system monitoring. The large 1,152-ball BGA package offers a dense interconnect solution but places significant demands on PCB fan-out, plane continuity, decoupling placement, and assembly inspection. Before committing to the device, confirm the exact ball map, supported I/O standards, bank voltage rules, configuration method, and thermal limits in the manufacturer datasheet.
推荐
推荐产品汇总
工程参考数据： EP2SGX60EFI1152 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2SGX60EF1152I5N | EP2SGX60EF1152I4N | EP2SGX60EF1152C5N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1,152-ball FineLine BGA | 1,152-ball FineLine BGA | 1,152-ball FineLine BGA | 1,152-ball FineLine BGA |
关键差异点
- Large verified logic-element count （对比 EP2SGX30FG780C7)
- High verified user-I/O count （对比 EP2SGX60EF1152C5N)
- Large BGA package （对比 EP2S60F484I4N)
设计说明
Confirm all required core, I/O, auxiliary, and configuration voltages from the manufacturer datasheet before schematic capture. The supplied data establishes a 1,152-ball package and FPGA function but does not provide voltage limits or current requirements. Use a distributed decoupling network, place high-frequency capacitors close to the relevant power balls, and preserve continuous reference planes across all supply domains.
Treat the 1,152-ball FineLine BGA as a high-density escape-routing challenge. Follow the manufacturer package drawing and PCB stack-up recommendations, maintain uniform via fields where appropriate, and verify the complete ball map against the exact ordering code. Route high-speed clocks, data, and differential pairs with controlled impedance while keeping return paths continuous through plane transitions.
Estimate junction temperature from the actual configuration, utilization, clock rates, and measured power because the supplied excerpts do not provide thermal resistance or power data. Start with the manufacturer thermal guidelines, calculate an estimated worst-case dissipation from measured or simulated rail current, and provide sufficient copper spreading, vias, airflow, or cooling for the production environment.
Validate every external interface against the FPGA’s supported I/O standards, bank rules, timing constraints, and termination recommendations. The verified value of 534 user I/O describes available pins, not simultaneous usability under every voltage or performance condition. Use simulation or measurement for high-speed interfaces and avoid assuming that a similarly named Stratix II GX MPN is pin-compatible.
合规信息
The supplied verified web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for EP2SGX60EFI1152.
