EP2SGX60EF1152I4 vs EP2SGX60EF1152C5N 对比
详细并排对比 EP2SGX60EF1152I4 出自 Intel 和 EP2SGX60EF1152C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60EF1152I4 | EP2SGX60EF1152C5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,395.00 | $3,300.00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Logic Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3022 |
| Embedded Memory | 2,544,192 bits | — |
| User I/O Pins | 534 | — |
| Maximum Internal Frequency | 717 MHz (per data source) | — |
| Maximum Operating Frequency | 732.1 MHz (per data source) | 609.76 MHz |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| 封装 | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) | 1152-ball FC-FBGA |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) | — |
| Temperature Grade | Industrial | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | -5 (mid) |
| 工作温度 | — | Commercial (0C to +85C) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |