EP2SGX60EF1162I4N vs EP2SGX60EF1152I3N 对比
详细并排对比 EP2SGX60EF1162I4N 出自 Altera 和 EP2SGX60EF1152I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60EF1162I4N | EP2SGX60EF1152I3N |
|---|---|---|
| 品牌 | Altera | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $392.00 | $1,195.00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Embedded Memory | 2,544,192 bits | — |
| DSP Blocks | 12 | — |
| 18x18 Multipliers | 252 | — |
| User I/Os | 534 | — |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| 封装 | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch | — |
| Speed Grade | I4 (industrial) | — |
| Temperature Range | -40C to +100C (junction) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Mode | Enhanced (EPC) / Fast Passive Parallel (FPP) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等级 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| RoHS 状态 | Compliant | Compliant |
| Process Node | 90 nm | — |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Process Technology | — | 90 nm |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Lead-Free | — | Yes |