EP2SGX60EF1162I4N vs EP2SGX60EF1152I3N Comparaison
Comparaison détaillée côte à côte de EP2SGX60EF1162I4N par Altera et EP2SGX60EF1152I3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX60EF1162I4N | EP2SGX60EF1152I3N |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $392,00 | $1 195,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Embedded Memory | 2,544,192 bits | — |
| DSP Blocks | 12 | — |
| 18x18 Multipliers | 252 | — |
| User I/Os | 534 | — |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Boîtier | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch | — |
| Speed Grade | I4 (industrial) | — |
| Temperature Range | -40C to +100C (junction) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Mode | Enhanced (EPC) / Fast Passive Parallel (FPP) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Niveau MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Statut RoHS | Compliant | Compliant |
| Process Node | 90 nm | — |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Process Technology | — | 90 nm |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Lead-Free | — | Yes |