EP2SGX90EF1152C5N vs EP2SGX90EF1152I3 对比

详细并排对比 EP2SGX90EF1152C5N 出自 Intel 和 EP2SGX90EF1152I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ 最后一次采购

规格对比

参数 EP2SGX90EF1152C5N EP2SGX90EF1152I3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $1,380.00 $1,480.00
Series Stratix II GX Stratix II GX
Family FPGA - Field Programmable Gate Array —
Logic Elements 90,960 90,960
Logic Array Blocks (LABs) 4,548 —
Total RAM Bits 4,520,448 4,520,448
User I/Os 558 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
封装 1152-ball FC-FBGA —
安装类型 Surface Mount Surface Mount
Speed Grade 5 —
工作温度 0C to +85C (Commercial) —
RoHS 状态 Compliant Compliant
MSL 等级 [DATA_NEEDED: MSL level] —
Transceivers Up to 12 multi-gigabit transceivers —
Transceiver Data Rate Up to 6.375 Gbps —
Adaptive Logic Modules (ALMs) — 558
Equivalent Logic Cells (CLBs) — 90,960
Maximum Operating Frequency — 622.08 MHz
Core Supply Voltage (VCCINT) — 1.2 V nominal (1.15 V to 1.25 V)
Operating Temperature Grade — Industrial (-40C to +100C)
Package Type — 1152-ball FC-FBGA (flip-chip)
Terminal Form — Ball
Terminal Pitch — [DATA_NEEDED: ball pitch]
Package Code — BGA
Package Shape — Square
Configuration Architecture — Enhanced Configuration (EPC) devices supported

数据手册与资源

浏览全部产品 创建 BOM 获取报价