EP2SGX90EF1152C5N vs EP2SGX90EF1152I3 Comparison

Detailed side-by-side comparison of EP2SGX90EF1152C5N by Intel and EP2SGX90EF1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Last Time Buy

Specification Comparison

Parameter EP2SGX90EF1152C5N EP2SGX90EF1152I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,380.00 $1,480.00
Series Stratix II GX Stratix II GX
Family FPGA - Field Programmable Gate Array β€”
Logic Elements 90,960 90,960
Logic Array Blocks (LABs) 4,548 β€”
Total RAM Bits 4,520,448 4,520,448
User I/Os 558 β€”
Number of I/O Banks [DATA_NEEDED: number of I/O banks] β€”
Core Voltage 1.2 V β€”
Process Technology 90 nm 90 nm CMOS
Package 1152-ball FC-FBGA β€”
Mounting Type Surface Mount Surface Mount
Speed Grade 5 β€”
Operating Temperature 0C to +85C (Commercial) β€”
RoHS Status Compliant Compliant
MSL Level [DATA_NEEDED: MSL level] β€”
Transceivers Up to 12 multi-gigabit transceivers β€”
Transceiver Data Rate Up to 6.375 Gbps β€”
Adaptive Logic Modules (ALMs) β€” 558
Equivalent Logic Cells (CLBs) β€” 90,960
Maximum Operating Frequency β€” 622.08 MHz
Core Supply Voltage (VCCINT) β€” 1.2 V nominal (1.15 V to 1.25 V)
Operating Temperature Grade β€” Industrial (-40C to +100C)
Package Type β€” 1152-ball FC-FBGA (flip-chip)
Terminal Form β€” Ball
Terminal Pitch β€” [DATA_NEEDED: ball pitch]
Package Code β€” BGA
Package Shape β€” Square
Configuration Architecture β€” Enhanced Configuration (EPC) devices supported

Datasheets & Resources

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