EP2SGX90EF1152I3 vs EP2SGX90FE1152C3 对比
详细并排对比 EP2SGX90EF1152I3 出自 Intel 和 EP2SGX90FE1152C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX90EF1152I3 | EP2SGX90FE1152C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,480.00 | $1,495.00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Family Name | — | Stratix II GX |
| Logic Elements / Cells | — | 90,960 |
| Number of LABs / CLBs | — | 4,548 |
| Number of Logic Elements / Cells | — | 90,960 |
| Number of I/O | — | 558 |
| Number of Gates | — | [DATA_NEEDED: gates count] |
| Voltage - Supply | — | 1.2 V core |
| 工作温度 | — | 0C to +85C (commercial, C3 suffix) |
| 封装 / 外壳 | — | 1152-BBGA / FC-FBGA |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Number of Transceiver Channels | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 192 |
| Configuration Support | — | PS, PPS, PPA, FPP, JTAG |
| 湿敏等级（MSL） | — | [DATA_NEEDED: MSL level] |