EP2SGX90EF1152I3 vs EP2SGX90FE1152C3 比較
詳細な並列比較: EP2SGX90EF1152I3 メーカー: Intel および EP2SGX90FE1152C3 メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP2SGX90EF1152I3 | EP2SGX90FE1152C3 |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | ラストバイ | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,480.00 | $1,495.00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| 実装タイプ | Surface Mount | Surface Mount (BGA) |
| RoHS ステータス | Compliant | [DATA_NEEDED: RoHS status] |
| Family Name | — | Stratix II GX |
| Logic Elements / Cells | — | 90,960 |
| Number of LABs / CLBs | — | 4,548 |
| Number of Logic Elements / Cells | — | 90,960 |
| Number of I/O | — | 558 |
| Number of Gates | — | [DATA_NEEDED: gates count] |
| Voltage - Supply | — | 1.2 V core |
| 動作温度 | — | 0C to +85C (commercial, C3 suffix) |
| パッケージ / ケース | — | 1152-BBGA / FC-FBGA |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Number of Transceiver Channels | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 192 |
| Configuration Support | — | PS, PPS, PPA, FPP, JTAG |
| 湿気感度レベル（MSL） | — | [DATA_NEEDED: MSL level] |