EP3C25F324C6N vs EP3C25F324C8 对比
详细并排对比 EP3C25F324C6N 出自 Intel 和 EP3C25F324C8 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C25F324C6N | EP3C25F324C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $62.30 | $23.10 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | — |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | 66 (18 x 18) |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | 4 |
| 封装 | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Speed Grade | C6 (commercial) | 8 (commercial) |
| 工作温度 | 0C to +85C (commercial) | 0 °C to +85 °C (commercial) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, SRAM-based |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Logic Elements | — | 24,624 LE |
| Logic Array Blocks | — | 1,539 LABs |
| Embedded Memory | — | 608,256 bits |
| User I/Os | — | 215 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock | — | 402 MHz |
| RoHS 状态 | — | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |