EP3C25F324I7 vs EP3C25F324C8 对比
详细并排对比 EP3C25F324I7 出自 Intel 和 EP3C25F324C8 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C25F324I7 | EP3C25F324C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $64.80 | $23.10 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | 608,256 bits |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm CMOS, SRAM-based |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| 工作结温 | -40 °C to +100 °C (industrial) | — |
| 封装 | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| RoHS 状态 | Compliant | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| Logic Elements | — | 24,624 LE |
| Logic Array Blocks | — | 1,539 LABs |
| Embedded Multipliers | — | 66 (18 x 18) |
| User I/Os | — | 215 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | 8 (commercial) |
| 工作温度 | — | 0 °C to +85 °C (commercial) |
| Maximum Internal Clock | — | 402 MHz |