EP3SE110F1152C4 vs EP3SE110F1152C4N 对比

详细并排对比 EP3SE110F1152C4 出自 Intel 和 EP3SE110F1152C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ 最后一次采购
Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ 最后一次采购

规格对比

参数 EP3SE110F1152C4 EP3SE110F1152C4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $2,200.00 $1,395.00
Family Stratix III E Stratix III Enhanced (E)
Logic Elements 107,500 107,500
Embedded Memory 8,936,448 bits —
Maximum User I/Os 744 —
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] 4300
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Maximum Performance 450 MHz —
Package Type 1152-ball FCBGA (Flip-Chip BGA) —
Operating Temperature Grade Commercial (C4) —
Configuration Memory SRAM-based (volatile) —
On-chip Termination Dynamic, programmable —
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL —
RoHS 状态 Compliant Compliant
Memory Bits — 8,936,448
Embedded Multipliers (18x18) — 896
User I/O Pins — 744
Maximum Operating Frequency — 450 MHz
封装 — 1152-ball FCBGA (Flip-Chip BGA)
安装类型 — Surface Mount
工作温度 — 0C to +85C (Commercial)
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG / AES-256
MSL 等级 — 3 (168 hours)
Design Software — Quartus II (v9.1 or later)

数据手册与资源

浏览全部产品 创建 BOM 获取报价