EP3SE260F1152C4N vs EP3SE260F1152C4 对比

详细并排对比 EP3SE260F1152C4N 出自 Intel 和 EP3SE260F1152C4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE260F1152C4N EP3SE260F1152C4
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 不推荐新设计
库存状态 有库存 有库存
单价(USD) $1,620.00 $8,900.00
Series Stratix III E Stratix III E (Enhanced)
Family Stratix III (Enhanced) Stratix III
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm CMOS (TSMC)
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz —
封装 1152-ball FC-FBGA (flip-chip) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Speed Grade -4 (commercial temperature) C4 (slowest commercial grade)
工作温度 0C to +85C (commercial, 'C' suffix) Commercial (0C to +85C) - inferred from speed grade C4
安装类型 Surface Mount (BGA) Surface Mount (BGA)
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
存储器类型 SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements (LE) — 255,000
Logic Array Blocks (LABs) — 10,200
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)
RoHS 状态 — Compliant (per distributor listings)

数据手册与资源

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