EP3SE260F1152C4N vs EP3SE260F1152C4 비교

다음의 상세 나란히 비교: EP3SE260F1152C4N 제조: Intel 및 EP3SE260F1152C4 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP3SE260F1152C4N EP3SE260F1152C4
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Obsolete NRND
재고 상태 In Stock In Stock
단가 (USD) $1,620.00 $8,900.00
Series Stratix III E Stratix III E (Enhanced)
Family Stratix III (Enhanced) Stratix III
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm CMOS (TSMC)
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz —
패키지 1152-ball FC-FBGA (flip-chip) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Speed Grade -4 (commercial temperature) C4 (slowest commercial grade)
동작 온도 0C to +85C (commercial, 'C' suffix) Commercial (0C to +85C) - inferred from speed grade C4
실장 유형 Surface Mount (BGA) Surface Mount (BGA)
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
메모리 유형 SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements (LE) — 255,000
Logic Array Blocks (LABs) — 10,200
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)
RoHS 상태 — Compliant (per distributor listings)

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