EP3SE260F1152I3N vs EP3SE260F1152C4N 对比
详细并排对比 EP3SE260F1152I3N 出自 Intel 和 EP3SE260F1152C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1152I3N | EP3SE260F1152C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,360.00 | $1,620.00 |
| Series | Stratix III E | Stratix III E |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | — |
| Logic Array Blocks (LABs) | 10200 | — |
| Total RAM Bits | 16672768 | — |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 1.1 V |
| 工作温度 | -40C to +100C (industrial) | 0C to +85C (commercial, 'C' suffix) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 封装 / 外壳 | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| 封装 | — | 1152-ball FC-FBGA (flip-chip) |
| Speed Grade | — | -4 (commercial temperature) |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| 存储器类型 | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |