EP3SE260F1517C2 vs EP3SE260F1517C3N 对比

详细并排对比 EP3SE260F1517C2 出自 Altera 和 EP3SE260F1517C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Altera
EP3SE260F1517C2 EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera

EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera

EP3SE260F1517C2 ⚠ 最后一次采购
Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ 最后一次采购

规格对比

参数 EP3SE260F1517C2 EP3SE260F1517C3N
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $15,800.00 $9,850.00
Series Stratix® III E —
Logic Elements (LE) 254,400 —
Logic Array Blocks (LAB) 10,200 —
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
Total Memory Bits 16,672,768 —
Distributed RAM (Kb) 4,608 —
Embedded Block RAM (Kb) 15,408 —
Embedded Multipliers (18x18) 384 —
User I/O Pins 976 —
High-Speed Transceivers 48 (up to 6.375 Gbps) —
PLLs 12 4
Speed Grade C2 C3 (commercial)
Temperature Grade Commercial (0C to +85C, suffix C2) —
封装 1517-BBGA, FCBGA 1517-BBGA (FCBGA)
安装类型 Surface Mount Surface Mount
Process Node TSMC 40 nm —
RoHS 状态 [DATA_NEEDED: RoHS compliance] Compliant
Family — Stratix III E
Logic Elements — 254,400
Embedded Memory — 16,672,768 bits (16.7 Mbits)
User I/Os — 976
DSP Blocks (18x18 Multipliers) — 816
M9K Memory Blocks — 1,040
Maximum Transceiver Data Rate — 600 Mbps
Global Clock Networks — 16
Process Technology — 65 nm TSMC low-power CMOS
工作结温 — 0 C to +85 C (commercial)
External Memory Interfaces — DDR3, DDR2, QDRII+, RLDRAM2

数据手册与资源

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