EP3SE260F1517C3 vs EP3SE260F1517C4N 对比
详细并排对比 EP3SE260F1517C3 出自 Intel 和 EP3SE260F1517C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517C3 | EP3SE260F1517C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10,800.00 | $7,800.00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | 16,672,768 bits |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 65 nm (TSMC) | 65 nm |
| 封装 | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Family | — | Field-Programmable Gate Array (FPGA) |
| Maximum User I/Os | — | 976 |
| 工作温度 | — | 0°C to 85°C |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |