EP3SE260F1517C3 vs EP3SE260F1517C4N Comparación
Comparación detallada lado a lado de EP3SE260F1517C3 por Intel y EP3SE260F1517C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517C3 | EP3SE260F1517C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.800,00 | $7.800,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | 16,672,768 bits |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 65 nm (TSMC) | 65 nm |
| Encapsulado | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Family | — | Field-Programmable Gate Array (FPGA) |
| Maximum User I/Os | — | 976 |
| Temperatura de funcionamiento | — | 0°C to 85°C |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |