EP3SE260F1517I4L vs EP3SE260F1517I4LN 对比
详细并排对比 EP3SE260F1517I4L 出自 Intel 和 EP3SE260F1517I4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517I4L | EP3SE260F1517I4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,800.00 | $2,895.00 |
| Family | Stratix III Enhanced (E) | Stratix III E (Enhanced) |
| Series | Stratix III | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | — |
| Maximum User I/O | 976 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | — |
| 安装类型 | Surface Mount | — |
| 工作温度 | -40C to +100C (Industrial) | -40C to +100C (case, industrial) |
| Temperature Grade | Industrial | — |
| Speed Grade | I4 | I4 (industrial, 4th tier) |
| Lead-Free / RoHS | Yes (L suffix) | Yes (N suffix) |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | — |
| MSL 等级 | 3 (per JEDEC J-STD-020) | — |
| RoHS 状态 | Compliant | — |
| Embedded Memory Bits | — | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| 封装 | — | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Power Option | — | L (low-power) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |