EP3SE260F1517I4L - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
料号： EP3SE260F1517I4L ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3600 | $36,000.00 |
| 100 | $3300 | $330,000.00 |
| 500 | $3050 | $1,525,000.00 |
| 1,000 | $2800 | $2,800,000.00 |
EP3SE260F1517I4L 概述
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and on-chip memory and DSP blocks. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), themselves a subcategory of application-specific integrated circuits (ASICs). Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, signal-processing pipelines, or even soft-processor systems. The Stratix III family uses TSMC's 65nm process and a programmable power technology that dynamically adjusts core voltage per tile to reduce static power.
Key features of the EP3SE260F1517I4L include 768 embedded 18x18 multipliers (ideal for DSP workloads), 48 transceivers (transceiver count varies by device variant - confirm via datasheet), up to 16.6 Mbits of embedded SRAM, support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II, and the HardCopy III block for ASIC prototyping. The device supports partial reconfiguration, allowing portions of the logic fabric to be reprogrammed while the rest continues to operate, which is critical for high-availability systems.
The architecture combines a high-speed interconnect fabric with column-based DSP and memory blocks, delivering deterministic timing and predictable performance for high-throughput signal processing. The 1517-BGA package exposes enough I/O for multi-channel memory interfaces and high-speed serial links, making it suitable for telecom line cards, broadcast video processing, and ASIC prototyping platforms where designers need many logic elements and large on-chip memory banks.
Typical applications include high-performance DSP pipelines (radar, software-defined radio, medical imaging), ASIC prototyping and emulation, high-speed serial connectivity aggregation, and test-and-measurement backplanes. The wide I/O count also makes the part suitable for telecommunications line-card designs that aggregate many lower-speed links into a single processing domain.
When designing with this FPGA, allocate sufficient PCB area for the 1517-ball FCBGA (typically 40mm x 40mm with a 1mm ball pitch), provide multi-layer PCB with continuous ground and power planes, and follow Intel's power-decoupling and thermal-management guidelines for high-density flip-chip packages. The device must be configured at every power-up using JTAG, passive serial, or a supporting configuration device.
This page synthesizes distributor pricing, parametric comparisons against same-family Stratix III E variants, and practical design notes that go beyond what the manufacturer datasheet provides.
直接替换替代料： EP3SE260F1517I4L ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE260F1517I4L （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Family, Operating Temperature, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
EP3SE260F1517I4
✅ 直接替换✓ 有现货
$10750 / 个
查看数据手册 →EP3SE260F1517C4L
✅ 直接替换✓ 有现货
$15100 / 个
查看数据手册 →EP3SE260F1517I3N
✅ 直接替换✓ 有现货
$2275 / 个
查看数据手册 →EP3SE260F1152I4L
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP3SE260F1517I3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$10500 / 个
查看数据手册 →EP3SE260F1517C3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$9850 / 个
查看数据手册 →EP3SE260F1517C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$7800 / 个
查看数据手册 →EP3SE260F1517I4L 最大额定值与电气特性
| Family | Stratix III Enhanced (E) |
| Series | Stratix III |
| Logic Elements | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) |
| Maximum User I/O | 976 |
| Package Type | 1517-BBGA, FCBGA |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +100C (Industrial) |
| Temperature Grade | Industrial |
| Speed Grade | I4 |
| Lead-Free / RoHS | Yes (L suffix) |
| Process Technology | 65 nm CMOS |
| DSP Blocks (18x18 Multipliers) | 768 |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
| RoHS 状态 | Compliant |
EP3SE260F1517I4L 40 mm x 40 mm (bga1517, 39x39, 1.0 mm pitch) 引脚配置指南
EP3SE260F1517I4L（40 mm x 40 mm (bga1517, 39x39, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE260F1517I4L.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE260F1517I4L 适用于 6 应用s: ASIC Prototyping and Emulation, High-Performance DSP Pipelines (Radar / SDR), Telecom Line Cards and Baseband Aggregation, Broadcast Video Processing and Encoding, Medical Imaging (Ultrasound / CT Beamforming), Industrial Test and Measurement Backplanes.
ASIC Prototyping and Emulation
The EP3SE260F1517I4L fits ASIC prototyping because its 255,000 logic elements and 16.6 Mbits of embedded memory can map large RTL designs onto a single FPGA, drastically shortening verification cycles. Placed on a multi-FPGA prototyping board, the device emulates ASIC subsystems with deterministic timing close to silicon. Designers benefit from partial reconfiguration, which lets them swap design blocks while the rest continues running - ideal for hardware-in-the-loop validation. Compared with newer ASIC prototyping platforms, the Stratix III E remains a cost-effective workhorse for designs up to ~10M ASIC gates.
推荐
High-Performance DSP Pipelines (Radar / SDR)
The EP3SE260F1517I4L's 768 dedicated 18x18 multipliers and high on-chip memory bandwidth make it well suited for radar signal processing and software-defined radio (SDR) channelization. Placed in a baseband processing card, the FPGA implements FFTs, channelizers, and beamformers with deterministic latency. The wide 976-user-I/O count allows direct attachment to multiple high-speed ADC/DAC pairs, minimizing external glue logic. Compared with DSP-only processors, the FPGA delivers 10-100x higher throughput per watt for parallelizable kernels such as correlators and pulse-compression filters.
推荐
Telecom Line Cards and Baseband Aggregation
The EP3SE260F1517I4L is widely deployed in telecom line cards where many lower-speed serial links aggregate into a higher-speed processing domain. Its 976 user I/O pins accommodate multiple SFP+/QSFP cages, and the embedded transceivers support CPRI/OBSAI fronthaul at standard cellular bitrates. The device's logic density allows multi-standard baseband processing (LTE, 5G NR) on a single chip. Compared with ASIC line-card solutions, the FPGA enables rapid multi-standard firmware updates, future-proofing operator capex.
推荐
Broadcast Video Processing and Encoding
The EP3SE260F1517I4L's combination of large embedded memory (16.6 Mbits) and high logic density supports multi-stream broadcast video encoding, scaling, and overlay composition. Placed in a broadcast switcher or video router, the FPGA implements real-time H.264/HEVC pre-processing, color-space conversion, and frame-rate conversion without external DSP chips. The DDR3 controller hard IP enables high-bandwidth frame buffer memory, essential for uncompressed 4K video paths. Compared with dedicated video ASSPs, the FPGA offers flexibility to add new codecs via firmware updates.
推荐
Medical Imaging (Ultrasound / CT Beamforming)
The EP3SE260F1517I4L supports real-time beamforming in ultrasound and CT imaging systems, where hundreds of channels must be processed with deterministic latency. Its 768 DSP blocks and high memory bandwidth handle delay-and-sum beamforming across 64-256 channels simultaneously. The industrial temperature grade (-40C to +100C) suits portable medical cart designs. Compared with GPU-based beamformers, the FPGA delivers lower and more deterministic latency - critical for image reconstruction timing.
推荐
Industrial Test and Measurement Backplanes
The EP3SE260F1517I4L fits high-channel-count automated test equipment (ATE) and oscilloscope backplanes where many analog channels must be digitized and pre-processed in parallel. Its 976 I/O and on-chip DSP enable per-channel calibration, decimation, and triggering without offloading to a host CPU. The partial reconfiguration feature allows on-the-fly switching between test personalities (e.g., protocol compliance vs parametric test). Compared with fixed-function ATE ASICs, the FPGA shortens development time for new test standards.
推荐
推荐产品汇总
工程参考数据： EP3SE260F1517I4L ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE260F1517I4 | EP3SE260F1517C4L | EP3SE260F1517I3N | EP3SE260F1152I4L |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA FCBGA (40x40 mm) | 1517-BBGA FCBGA (same) | 1517-BBGA FCBGA (same) | 1517-BBGA FCBGA (same) | 1152-BBGA FCBGA (smaller) |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | 16.6 Mbits | 16.6 Mbits | 16.6 Mbits | 16.6 Mbits |
| Maximum User I/O | 976 | 976 | 976 | 976 | 744 (1152-BGA) |
| Speed Grade | I4 (industrial fastest) | I4 | C4 (commercial) | I3 (industrial, slower) | I4 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Industrial | Industrial |
| Lead-Free / RoHS | Yes (L suffix) | No (no L suffix) | Yes (L suffix) | Yes (N lead-free) | Yes (L suffix) |
| Approx Unit Price (qty-1, USD) | $3,850 | $3,800 (approx) | $3,700 (approx) | $3,600 (approx) | $3,400 (approx) |
关键差异点
- Lead-free (RoHS) finish at the highest I4 industrial speed grade （对比 EP3SE260F1517I4)
- 1517-BGA exposes 976 user I/O - the highest pin-count variant in the EP3SE260 family （对比 EP3SE260F1152I4L)
- Industrial temperature grade (-40C to +100C) for harsh environments （对比 EP3SE260F1517C4L)
- I4 speed grade provides the highest Fmax for performance-critical designs （对比 EP3SE260F1517I3N)
设计说明
The 1517-BGA FCBGA package (40 mm x 40 mm, 1.0 mm pitch) requires a high-layer-count PCB (typically 12+ layers) with microvia and via-in-pad technology to escape the dense ball array. Use Intel's pin table to assign each ball to its I/O bank and follow the recommended BGA escape routing pattern. Continuous ground and power planes are mandatory below the device to provide low-impedance current return paths and to manage the high simultaneous switching current that the 976 I/O can demand.
Stratix III E devices can dissipate 15-25 W in typical high-utilization designs. Provide a thermal solution: either a heatsink with thermal interface material attached to the top of the package, or a substantial copper spreader on the PCB. The FCBGA does not have an exposed pad, so top-side cooling is the primary thermal path. Estimate: a 10 W dissipation with theta_JA of 1.5 C/W (heatsink-attached) yields a 15C junction rise; verify in your specific mechanical assembly.
Stratix III E uses multi-rail power: core (typically 0.9V), I/O banks at varying voltages (1.2V-3.3V), and auxiliary rails for transceivers and PLL. Decoupling must follow Intel's recommended capacitor count and placement, with bulk capacitors within 100 mils of each ball group. Use the PowerPlay Early Power Estimator spreadsheet to model power before schematic finalisation. Estimated: at 50% logic utilisation and 200 MHz, total power is typically 8-15 W depending on toggle rate.
Do not exceed the maximum I/O bank count or mix incompatible I/O standards within the same bank without consulting the device handbook. The configuration scheme (JTAG, Passive Serial, Fast Passive Parallel) requires a companion configuration memory - omit only if using JTAG download for prototype work. Always include a JTAG header for boundary-scan testing and in-system programming. The 'L' suffix denotes lead-free finish; the non-L variant (EP3SE260F1517I4) is not RoHS-compliant and should not be used for products shipped into regions requiring RoHS.
合规信息
RoHS compliant per L suffix and Intel product page documentation. AEC-Q100 not applicable (FPGAs are not typically AEC-Q100 qualified unless explicitly noted). REACH compliance per Intel product page statement. Halogen-free status not stated in verified data - set to unknown.
