EP3SE260F1517I4LN vs EP3SE260F1517I4L 对比

详细并排对比 EP3SE260F1517I4LN 出自 Intel 和 EP3SE260F1517I4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1517I4LN EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN ⚠ 最后一次采购

规格对比

参数 EP3SE260F1517I4LN EP3SE260F1517I4L
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $2,895.00 $2,800.00
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits (~2,044 KBytes) —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 976 —
封装 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) —
Process Technology 40 nm CMOS 65 nm CMOS
Family Stratix III E (Enhanced) Stratix III Enhanced (E)
Speed Grade I4 (industrial, 4th tier) I4
Power Option L (low-power) —
工作温度 -40C to +100C (case, industrial) -40C to +100C (Industrial)
Lead-Free / RoHS Yes (N suffix) Yes (L suffix)
Transceivers Stratix III E family supports up to 24 transceivers up to 8.5 Gbps —
DSP Blocks (18x18 multipliers) Up to 384 (family-level, device-specific count not in provided data) —
Partial Reconfiguration Supported —
Memory Interface Support DDR3, DDR2, QDR II+ (hardened PHY) —
Configuration Scheme Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG —
Series — Stratix III
Embedded Memory — 16,672,768 bits (16.6 Mbits)
Maximum User I/O — 976
Package Type — 1517-BBGA, FCBGA
Package Dimensions — 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch)
安装类型 — Surface Mount
Temperature Grade — Industrial
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
DSP Blocks (18x18 Multipliers) — 768
Configuration Method — JTAG, Passive Serial, Fast Passive Parallel
MSL 等级 — 3 (per JEDEC J-STD-020)
RoHS 状态 — Compliant

数据手册与资源

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