EP3SE260F1517I4LN vs EP3SL200F1517I4LN 对比

详细并排对比 EP3SE260F1517I4LN 出自 Intel 和 EP3SL200F1517I4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1517I4LN EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN ⚠ 最后一次采购

规格对比

参数 EP3SE260F1517I4LN EP3SL200F1517I4LN
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $2,895.00 $6,300.00
Logic Elements 255,000 200,000
Embedded Memory Bits 16,672,768 bits (~2,044 KBytes) 10,901,504
Logic Array Blocks (LABs) 10,200 8,000
User I/O Count 976 —
封装 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) 1517-BBGA, FCBGA
Process Technology 40 nm CMOS 65 nm TSMC low-power
Family Stratix III E (Enhanced) Stratix III L
Speed Grade I4 (industrial, 4th tier) —
Power Option L (low-power) —
工作温度 -40C to +100C (case, industrial) -40C to +100C (Industrial)
Lead-Free / RoHS Yes (N suffix) —
Transceivers Stratix III E family supports up to 24 transceivers up to 8.5 Gbps —
DSP Blocks (18x18 multipliers) Up to 384 (family-level, device-specific count not in provided data) 384
Partial Reconfiguration Supported —
Memory Interface Support DDR3, DDR2, QDR II+ (hardened PHY) —
Configuration Scheme Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG —
User I/O Pins — 976
安装类型 — Surface Mount (BGA)
RoHS 状态 — Compliant
Lead-Free — Yes
MSL 等级 — [DATA_NEEDED: MSL moisture sensitivity level]
Supply Voltage Core — [DATA_NEEDED: VCC core voltage]
Transceiver Data Rate (max) — [DATA_NEEDED: max transceiver rate]
DSP Performance — 288 GMACS
Configuration Method — Passive Parallel / Active Serial / JTAG
Ball Pitch — 1.0 mm
Package Dimensions — 40 mm x 40 mm

数据手册与资源

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