EP3SE260F1517I4LN vs EP3SL200F1517I4LN Comparison
Detailed side-by-side comparison of EP3SE260F1517I4LN by Intel and EP3SL200F1517I4LN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN β Last Time BuySpecification Comparison
| Parameter | EP3SE260F1517I4LN | EP3SL200F1517I4LN |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,895.00 | $6,300.00 |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits (~2,044 KBytes) | 10,901,504 |
| Logic Array Blocks (LABs) | 10,200 | 8,000 |
| User I/O Count | 976 | β |
| Package | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) | 1517-BBGA, FCBGA |
| Process Technology | 40 nm CMOS | 65 nm TSMC low-power |
| Family | Stratix III E (Enhanced) | Stratix III L |
| Speed Grade | I4 (industrial, 4th tier) | β |
| Power Option | L (low-power) | β |
| Operating Temperature | -40C to +100C (case, industrial) | -40C to +100C (Industrial) |
| Lead-Free / RoHS | Yes (N suffix) | β |
| Transceivers | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps | β |
| DSP Blocks (18x18 multipliers) | Up to 384 (family-level, device-specific count not in provided data) | 384 |
| Partial Reconfiguration | Supported | β |
| Memory Interface Support | DDR3, DDR2, QDR II+ (hardened PHY) | β |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | β |
| User I/O Pins | β | 976 |
| Mounting Type | β | Surface Mount (BGA) |
| RoHS Status | β | Compliant |
| Lead-Free | β | Yes |
| MSL Level | β | [DATA_NEEDED: MSL moisture sensitivity level] |
| Supply Voltage Core | β | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | β | [DATA_NEEDED: max transceiver rate] |
| DSP Performance | β | 288 GMACS |
| Configuration Method | β | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | β | 1.0 mm |
| Package Dimensions | β | 40 mm x 40 mm |