EP3SE260H780I3 vs EP3SE260H780C2N 对比

详细并排对比 EP3SE260H780I3 出自 Intel 和 EP3SE260H780C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ 最后一次采购

规格对比

参数 EP3SE260H780I3 EP3SE260H780C2N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $1,410.00 $3,600.00
Family Stratix III E —
Logic Elements 255,000 255,000
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 —
Embedded 18x18 Multipliers 384 —
User I/Os 488 —
Operating Frequency (logic) 500 MHz —
Operating Frequency (internal max) 800 MHz —
Process Technology 65 nm —
Core Voltage 1.1 V 0.9 V
封装 780-Ball FC-HFBGA / FCBGA 780-BGA FCBGA
安装类型 Surface Mount Surface Mount
湿敏等级(MSL) 3 (168 Hours) —
RoHS 状态 Lead Free / Compliant [DATA_NEEDED: rohs status]
工作温度 -40C to +100C (Industrial) —
Series — Stratix III E
LABs / CLBs — 10,200
Total RAM Bits — 16,672,768
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
工作温度范围 — Commercial (0C to +85C)
Speed Grade — C2
MSL 等级 — 3 (168 hours)
Reflow Peak Time Max — 40 s
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

数据手册与资源

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