EP3SE260H780I4L vs EP3SE260H780I4N 对比
详细并排对比 EP3SE260H780I4L 出自 Intel 和 EP3SE260H780I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260H780I4L | EP3SE260H780I4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,395.00 | $2,150.00 |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| 安装类型 | Surface Mount (flip-chip) | — |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| 工作温度 | Industrial, -40C to +85C | -40C to +100C (Industrial) |
| RoHS 状态 | Compliant (lead-free) | Compliant |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 450 MHz |
| 封装 | — | 780-pin FC-HFBGA (FCBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |